Inventor · disambiguated record
Nun-Sian Tsai
Also filed as: TSAI NUN-SIAN
12 granted patents·285 citations·filing 1988–1997
93Inventor score
Top patents by PatentIndex Score
12 records- 0182US4886765AMethod of making silicides by heating in oxygen to remove contaminationAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Dec 12, 1989·41 cites·10 claims
- 0271US5235204AReverse self-aligned transistor integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 1991·Granted Aug 10, 1993·33 cites·9 claims
- 0371US5028557AMethod of making a reverse self-aligned BIMOS transistor integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 1990·Granted Jul 2, 1991·39 cites·11 claims
- 0467US4981550ASemiconductor device having tungsten plugsAT & T BELL LAB·Filed 1988·Granted Jan 1, 1991·34 cites·7 claims
- 0565US5861671AProcess for removing seams in tungsten plugsTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jan 19, 1999·28 cites·2 claims
- 0660US5466615ASilicon damage free process for double poly emitter and reverse MOS in BiCMOS applicationTAIWAN SEMICONDUCTOR MFG·Filed 1993·Granted Nov 14, 1995·18 cites·17 claims
- 0757US5677237AProcess for removing seams in tungsten plugsTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Oct 14, 1997·20 cites·26 claims
- 0855US4985371AProcess for making integrated-circuit device metallizationAT & T BELL LAB·Filed 1988·Granted Jan 15, 1991·21 cites·25 claims
- 0954US5175606AReverse self-aligned BiMOS transistor integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 1991·Granted Dec 29, 1992·19 cites·10 claims
- 1052US5071780AReverse self-aligned transistor integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 1990·Granted Dec 10, 1991·15 cites·11 claims
- 1150US5700726AMulti-layered tungsten depositions for contact hole fillingTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Dec 23, 1997·17 cites·12 claims
- 1229US5831307ASilicon damage free process for double poly emitter and reverse MOS in BICMOS applicationTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Nov 3, 1998·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →