Inventor · disambiguated record
Vladimir Tamarkin
Also filed as: TAMARKIN VLADIMIR · TAMARKIN VLADIMIR K
28 granted patents·2 pending applications·693 citations·filing 1998–2021
97Inventor score
Top patents by PatentIndex Score
30 records- 0195US5986887AStacked circuit board assembly adapted for heat dissipationUNISYS CORP·Filed 1998·Granted Nov 16, 1999·120 cites·26 claims
- 0294US6049467AStackable high density RAM modulesUNISYS CORP·Filed 1998·Granted Apr 11, 2000·190 cites·18 claims
- 0393US7983194B1Method and system for multi level switch configurationQLOGIC CORP·Filed 2009·Granted Jul 19, 2011·31 cites·9 claims
- 0492US9413097B2High density cabled midplanes and backplanesINTEL CORP·Filed 2014·Granted Aug 9, 2016·18 cites·7 claims
- 0591US7646602B1Apparatus and methods for cooling network switchesQLOGIC CORP·Filed 2008·Granted Jan 12, 2010·22 cites·18 claims
- 0690US8873236B1Electronic devices having cooling module with direction-configurable airflowTAMARKIN VLADIMIR·Filed 2012·Granted Oct 28, 2014·14 cites·16 claims
- 0787US8532086B1Method and system for multi level switch configurationGENETTI WAYNE A·Filed 2011·Granted Sep 10, 2013·11 cites·6 claims
- 0887US5903439AMezzanine connector assemblyUNISYS CORP·Filed 1998·Granted May 11, 1999·55 cites·25 claims
- 0986US6256769B1Printed circuit board routing techniquesUNISYS CORP·Filed 1999·Granted Jul 3, 2001·69 cites·17 claims
- 1085US9710421B2Peripheral component interconnect express (PCIe) card having multiple PCIe connectorsINTEL CORP·Filed 2014·Granted Jul 18, 2017·12 cites·19 claims
- 1185US8060682B1Method and system for multi-level switch configurationGENETTI WAYNE A·Filed 2009·Granted Nov 15, 2011·17 cites·13 claims
- 1284US7675750B1Apparatus and methods for cooling networks switchesQLOGIC CORP·Filed 2008·Granted Mar 9, 2010·11 cites·13 claims
- 1380US8068338B1Network device with baffle for redirecting cooling air and associated methodsTAMARKIN VLADIMIR·Filed 2009·Granted Nov 29, 2011·9 cites·5 claims
- 1479US10176143B2Peripheral component interconnect express (PCIE) card having multiple PCIE connectorsINTEL CORP·Filed 2017·Granted Jan 8, 2019·2 cites·6 claims
- 1575US9697160B2Midplane interconnect system with conductor twist mitigationINTEL CORP·Filed 2014·Granted Jul 4, 2017·3 cites·7 claims
- 1671US7447778B2System and method for a shared I/O subsystemQLOGIC CORP·Filed 2002·Granted Nov 4, 2008·14 cites·48 claims
- 1771US6428327B1Flexible adapter for use between LGA device and printed circuit boardUNISYS CORP·Filed 1999·Granted Aug 6, 2002·35 cites·10 claims
- 1868US6022466AProcess of plating selective areas on a printed circuit boardUNISYS CORP·Filed 1998·Granted Feb 8, 2000·20 cites·16 claims
- 1967US6540527B1Method and adapter for reworking a circuit containing an LGA deviceUNISYS CORP·Filed 2000·Granted Apr 1, 2003·16 cites·12 claims
- 2066US7667985B1Computer network device and method of assemblyQLOGIC CORP·Filed 2008·Granted Feb 23, 2010·4 cites·6 claims
- 2162US11830863B2Dual-sided co-packaged optics for high bandwidth networking applicationsINTEL CORP·Filed 2021·Granted Nov 28, 2023·0 cites·19 claims
- 2262US7907414B1Network device having levers and associated methodsQLOGIC CORP·Filed 2009·Granted Mar 15, 2011·2 cites·15 claims
- 2361US11217573B2Dual-sided co-packaged optics for high bandwidth networking applicationsINTEL CORP·Filed 2020·Granted Jan 4, 2022·0 cites·25 claims
- 2454US9954295B2Midplane interconnect system with conductor twist mitigationINTEL CORP·Filed 2017·Granted Apr 24, 2018·0 cites·11 claims
- 2553US7844715B2System and method for a shared I/O subsystemQLOGIC CORP·Filed 2008·Granted Nov 30, 2010·0 cites·20 claims
- 2652US6310412B1Three-phase AC distribution system and method for printed circuit boardsUNISYS CORP·Filed 1999·Granted Oct 30, 2001·15 cites·4 claims
- 2748US2016183402A1Reducing trace length and insertion loss of high speed signals on a network switch boardINTEL CORP·Filed 2014·Application pending·0 cites
- 2846US9917392B2High density cabled midplanes and backplanesINTEL CORP·Filed 2016·Granted Mar 13, 2018·0 cites·9 claims
- 2945US2021210478A1Packaging solutions for high bandwidth networking applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 3033US6123251AApparatus and method for solderingUNISYS CORP·Filed 1999·Granted Sep 26, 2000·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →