Inventor · disambiguated record
Ralf Reichenbach
Also filed as: REICHENBACH RALF
16 granted patents·8 pending applications·37 citations·filing 2005–2016
89Inventor score
Top patents by PatentIndex Score
24 records- 0183US7919907B2Circuit moduleBOSCH GMBH ROBERT·Filed 2007·Granted Apr 5, 2011·13 cites·28 claims
- 0271US8607450B2Method for manufacturing a micropump and micropumpCASSEMEYER JULIA·Filed 2008·Granted Dec 17, 2013·4 cites·42 claims
- 0371US8040023B2Bending transducer for generating electrical energy from mechanical deformationsBOSCH GMBH ROBERT·Filed 2009·Granted Oct 18, 2011·5 cites·15 claims
- 0466US8113059B2Circuit moduleBUCK THOMAS·Filed 2007·Granted Feb 14, 2012·2 cites·13 claims
- 0561US8939165B2Microvalve, micropump and manufacturing methodREICHENBACH RALF·Filed 2009·Granted Jan 27, 2015·4 cites·28 claims
- 0661US8638000B2Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chipTRAUTMANN ACHIM·Filed 2010·Granted Jan 28, 2014·2 cites·11 claims
- 0759US8429971B2Multiaxial micromechanical acceleration sensorCLASSEN JOHANNES·Filed 2007·Granted Apr 30, 2013·3 cites·10 claims
- 0858US8987921B2Multifunction sensor as PoP microwave PCBSCHOLZ ULRIKE·Filed 2011·Granted Mar 24, 2015·2 cites·18 claims
- 0958US8154174B2Bending transducer device for generating electrical energy from deformations and circuit moduleLAERMER FRANZ·Filed 2009·Granted Apr 10, 2012·2 cites·15 claims
- 1054US2010166585A1Microdosing Device for Dosing of Smallest Quantities of a MediumBOSCH GMBH ROBERT·Filed 2008·Application pending·0 cites
- 1154US2008050610A1Method for manufacturing an at least partially porous, hollow silicon body, hollow silicon bodies manufacturable by this method, and uses of these hollow silicon bodiesSTUMBER MICHAEL·Filed 2007·Application pending·0 cites
- 1252US8671746B2Piezoelectric generatorLAERMER FRANZ·Filed 2010·Granted Mar 18, 2014·0 cites·13 claims
- 1352US8148234B2Method for manufacturing a semiconductor structure, and a corresponding Semiconductor StructureLAMMEL GERHARD·Filed 2007·Granted Apr 3, 2012·0 cites·12 claims
- 1451US2010009077A1Method for Treating a Material Having Nanoscale PoresLAERMER FRANZ·Filed 2007·Application pending·0 cites
- 1550US9032608B2Method for manufacturing at least one mechanical-electrical energy conversion systemLAERMER FRANZ·Filed 2009·Granted May 19, 2015·0 cites·22 claims
- 1650US8492850B2Method for producing a silicon substrate having modified surface properties and a silicon substrate of said typeLAMMEL GERHARD·Filed 2007·Granted Jul 23, 2013·0 cites·5 claims
- 1747US2012132925A1Method for manufacturing a semiconductor structure, and a corresponding semiconductor structureLAMMEL GERHARD·Filed 2012·Application pending·0 cites
- 1845US9416000B2Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elementsBOSCH GMBH ROBERT·Filed 2015·Granted Aug 16, 2016·0 cites·4 claims
- 1943US8377315B2Method for manufacturing porous microstructures, porous microstructures manufactured according to this method, and the use thereofBOSCH GMBH ROBERT·Filed 2008·Granted Feb 19, 2013·0 cites·17 claims
- 2039US10017376B2MEMS element including a stress decoupling structure and a component including such a MEMS elementBOSCH GMBH ROBERT·Filed 2015·Granted Jul 10, 2018·0 cites·8 claims
- 2137US2018208458A1Method for manufacturing a microelectronic media sensor assembly, and microelectronic media sensor assemblyBOSCH GMBH ROBERT·Filed 2016·Application pending·0 cites
- 2233US2017081177A1Interposer for mounting a vertically integrated hybrid component on a component carrierBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 2333US2015353345A1Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling StructureBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 2431US2009004388A1Method for Depositing an Anti-Adhesion LayerLARMER FRANZ·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →