Inventor · disambiguated record
Myeong-Ho Hong
Also filed as: HONG MYEONG H · HONG MYEONG HO
7 granted patents·10 pending applications·84 citations·filing 2006–2021
80Inventor score
Files withSAMSUNG ELECTRO MECH10CHO JAE CHOON2SAMSUNG ELECTRONICS CO LTD2CHO SUK HYEON1HONG MYEONG HO1
Top patents by PatentIndex Score
17 records- 0197US10026681B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·63 cites·36 claims
- 0289US7653990B2Manufacturing method of printed circuit board using an ink jetSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 2, 2010·20 cites·14 claims
- 0366US11594505B2Semiconductor package substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 0459US11114397B2Semiconductor package substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·18 claims
- 0552US2009183903A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0650US8187518B2Method for manufacturing substrate by imprintingLEE CHOON-KEUN·Filed 2007·Granted May 29, 2012·1 cites·5 claims
- 0750US2008090084A1Flame retardant resin composition for printed circuit board and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0848US2008012168A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0944US8216503B2Method for manufacturing printed circuit board using imprintingCHO JAE-CHOON·Filed 2007·Granted Jul 10, 2012·0 cites·10 claims
- 1044US2008054518A1Method of manufacturing a stamperSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1143US8840967B2Method for manufacturing printed circuit board including flame retardant insulation layerCHO JAE-CHOON·Filed 2011·Granted Sep 23, 2014·0 cites·13 claims
- 1243US2012324723A1Method of manufacturing coreless substrateHONG MYEONG HO·Filed 2012·Application pending·0 cites
- 1343US2015053456A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1442US2007020397A1Method of fabricating printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1541US2006222833A1Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1634US2012111728A1Method of manufacturing circuit boardCHO SUK HYEON·Filed 2011·Application pending·0 cites
- 1727US2015198888A1Method for manufacturing substrate for packageSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Myeong-Ho Hong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →