Inventor · disambiguated record
Yasuko Imanishi
Also filed as: IMANISHI YASUKO
3 granted patents·2 citations·filing 2009–2014
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0158US8946746B2Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing sameFUKUNAGA TAKAHIRO·Filed 2009·Granted Feb 3, 2015·2 cites·20 claims
- 0251US9960325B2Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing samePANASONIC IP MAN CO LTD·Filed 2014·Granted May 1, 2018·0 cites·1 claims
- 0334US8110904B2Lead frame for semiconductor device and method of manufacturing of the sameIMANISHI YASUKO·Filed 2011·Granted Feb 7, 2012·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →