Inventor · disambiguated record
Armand Vincent C. Jereza
Also filed as: JEREZA ARMAND VINCENT · JEREZA ARMAND VINCENT C · JEREZA ARMAND VINCENT CORAZO
8 granted patents·1 pending application·74 citations·filing 2006–2018
85Inventor score
Technology areasH10W
Files withFAIRCHILD SEMICONDUCTOR3JEREZA ARMAND VINCENT C3FAIRCHILD SEMICONDUCTOR CORPORATON1JEREZA ARMAND VINCENT1JMJ KOREA CO LTD1
Top patents by PatentIndex Score
9 records- 0190US7371616B2Clipless and wireless semiconductor die package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted May 13, 2008·28 cites·21 claims
- 0284US8222718B2Semiconductor die package and method for making the sameJEREZA ARMAND VINCENT C·Filed 2009·Granted Jul 17, 2012·12 cites·17 claims
- 0383US7816784B2Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 19, 2010·12 cites·24 claims
- 0478US8188587B2Semiconductor die package including lead with end portionJEREZA ARMAND VINCENT C·Filed 2008·Granted May 29, 2012·10 cites·10 claims
- 0572US8497164B2Semiconductor die package and method for making the sameJEREZA ARMAND VINCENT C·Filed 2012·Granted Jul 30, 2013·3 cites·17 claims
- 0672US7898067B2Pre-molded, clip-bonded multi-die semiconductor packageFAIRCHILD SEMICONDUCTOR CORPORATON·Filed 2008·Granted Mar 1, 2011·8 cites·25 claims
- 0769US10535589B2Clip structure and semiconductor package using the sameJMJ KOREA CO LTD·Filed 2018·Granted Jan 14, 2020·1 cites·14 claims
- 0842US2009179315A1Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the SameJEREZA ARMAND VINCENT·Filed 2008·Application pending·0 cites
- 0937US9685398B2Thin semiconductor device packagesFAIRCHILD SEMICONDUCTOR·Filed 2016·Granted Jun 20, 2017·0 cites·21 claims
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