Inventor · disambiguated record
Sean Smith
Also filed as: SMITH SEAN · SMITH SEAN P E
8 granted patents·1 pending application·455 citations·filing 2002–2022
89Inventor score
Top patents by PatentIndex Score
9 records- 0199US7045453B2Very low effective dielectric constant interconnect structures and methods for fabricating the sameIBM·Filed 2005·Granted May 16, 2006·221 cites·9 claims
- 0296US7023093B2Very low effective dielectric constant interconnect Structures and methods for fabricating the sameIBM·Filed 2002·Granted Apr 4, 2006·112 cites·22 claims
- 0395US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0492US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 0581US7407605B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2007·Granted Aug 5, 2008·8 cites·3 claims
- 0675US7867897B2Low leakage metal-containing cap process using oxidationIBM·Filed 2009·Granted Jan 11, 2011·4 cites·9 claims
- 0766US7598614B2Low leakage metal-containing cap process using oxidationIBM·Filed 2006·Granted Oct 6, 2009·2 cites·11 claims
- 0858US2022364239A1Electroless copper coating process for chromium metal powdersGLOBAL TUNGSTEN & POWDERS CORP·Filed 2022·Application pending·0 cites
- 0945US7253106B2Manufacturable CoWP metal cap process for copper interconnectsIBM·Filed 2004·Granted Aug 7, 2007·1 cites·41 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →