Inventor · disambiguated record
Diane Lai
Also filed as: LAI DIANE · LAI DIANE W
5 granted patents·225 citations·filing 2001–2004
83Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO5
Top patents by PatentIndex Score
5 records- 0193US6716737B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 6, 2004·133 cites·32 claims
- 0292US6555480B2Substrate with fluidic channel and method of manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Apr 29, 2003·58 cites·66 claims
- 0378US6764605B2Particle tolerant architecture for feed holes and method of manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 20, 2004·19 cites·4 claims
- 0462US6902872B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jun 7, 2005·11 cites·38 claims
- 0549US7432582B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 7, 2008·4 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →