Inventor · disambiguated record
Sakae Kitajo
Also filed as: KITAJO SAKAE
29 granted patents·6 pending applications·637 citations·filing 1992–2008
97Inventor score
Top patents by PatentIndex Score
35 records- 0196US6611057B2Semiconductor device attaining both high speed processing and sufficient cooling capacityNEC CORP·Filed 2001·Granted Aug 26, 2003·136 cites·22 claims
- 0294US6998704B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2003·Granted Feb 14, 2006·86 cites·56 claims
- 0391US6477284B1Photo-electric combined substrate, optical waveguide and manufacturing process thereforNEC CORP·Filed 2000·Granted Nov 5, 2002·61 cites·11 claims
- 0490US8308453B2Diaphragm pumpYAMAMOTO MITSURU·Filed 2008·Granted Nov 13, 2012·28 cites·19 claims
- 0587US6670699B2Semiconductor device packaging structureNEC CORP·Filed 2002·Granted Dec 30, 2003·48 cites·23 claims
- 0686US7420807B2Cooling device for electronic apparatusNEC CORP·Filed 2003·Granted Sep 2, 2008·36 cites·25 claims
- 0781US6934429B2Optical waveguide board and optical moduleNEC CORP·Filed 2002·Granted Aug 23, 2005·23 cites·16 claims
- 0879US7564164B2Drive circuit for piezoelectric pump and cooling system that uses this drive circuitNEC CORP·Filed 2005·Granted Jul 21, 2009·10 cites·17 claims
- 0976US6438504B2Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation finsNEC CORP·Filed 2001·Granted Aug 20, 2002·21 cites·2 claims
- 1075US7230328B2Semiconductor package and laminated semiconductor packageNEC CORP·Filed 2003·Granted Jun 12, 2007·22 cites·9 claims
- 1174US8081460B2Liquid-cooled heat radiatorISHIDA TOMOTAKA·Filed 2007·Granted Dec 20, 2011·8 cites·19 claims
- 1272US6926188B2Transfer apparatus for arraying small conductive bumps on a substrate and/ or chipJAPAN E M CO LTD·Filed 2003·Granted Aug 9, 2005·15 cites·9 claims
- 1370US6829079B2Optical path control apparatus with mirror section, and manufacturing method for the sameNEC CORP·Filed 2001·Granted Dec 7, 2004·12 cites·7 claims
- 1469US7242828B2Optical circuit in which fabrication is easyNEC CORP·Filed 2003·Granted Jul 10, 2007·9 cites·10 claims
- 1569US6674016B2Electronic componentNITTO DENKO CORP·Filed 2002·Granted Jan 6, 2004·15 cites·11 claims
- 1669US5838066AMiniaturized cooling fan type heatsink for a semiconductior deviceNEC CORP·Filed 1996·Granted Nov 17, 1998·36 cites·9 claims
- 1767US6889886B2Transfer apparatus for arraying small conductive bumps on substrate and/ or chipJAPAN E M CO LTD·Filed 2002·Granted May 10, 2005·12 cites·30 claims
- 1855US7483261B2Cooling device for an electronic equipmentNEC CORP·Filed 2004·Granted Jan 27, 2009·6 cites·17 claims
- 1955US6999643B2Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring boardNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Feb 14, 2006·4 cites·19 claims
- 2055US6430327B1Optical module and manufacturing method thereofNEC CORP·Filed 2000·Granted Aug 6, 2002·4 cites·14 claims
- 2154US6670208B2Optical circuit in which fabrication is easyNEC CORP·Filed 2001·Granted Dec 30, 2003·3 cites·40 claims
- 2253US7352069B2Electronic component unitNITTO DENKO CORP·Filed 2003·Granted Apr 1, 2008·5 cites·11 claims
- 2353US6238086B1Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation finsNEC CORP·Filed 1999·Granted May 29, 2001·16 cites·17 claims
- 2450US2008110600A1Cooling apparatus for electronic devicesNEC CORP·Filed 2007·Application pending·0 cites
- 2549US7594644B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2005·Granted Sep 29, 2009·0 cites·19 claims
- 2646US5241452APackage with heat sinkNEC CORP·Filed 1992·Granted Aug 31, 1993·15 cites·1 claims
- 2745US2010012299A1Heat exchanger unitNEC CORP·Filed 2008·Application pending·0 cites
- 2844US7826225B2Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiatorSHOWA DENKO KK·Filed 2004·Granted Nov 2, 2010·3 cites·33 claims
- 2944US2010025019A1Heat exchanger for cooling semiconductor chip and method of manufacturing the sameSAKAMOTO HITOSHI·Filed 2007·Application pending·0 cites
- 3043US2007006996A1Cooler for electronic equipmentMIKUBO KAZUYUKI·Filed 2004·Application pending·0 cites
- 3141US7119438B2Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor deviceJAPAN E M CO LTD·Filed 2003·Granted Oct 10, 2006·3 cites·12 claims
- 3240US2007065308A1Diaphragm pump and cooling system with the diaphragm pumpYAMAMOTO MITSURU·Filed 2004·Application pending·0 cites
- 3339US2003053765A1Photo-electric combined substrateNEC CORP·Filed 2002·Application pending·0 cites
- 3437US8720531B2Electronic device cooling apparatusISHIDA TOMOTAKA·Filed 2007·Granted May 13, 2014·0 cites·2 claims
- 3533US7106426B2Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalkNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Sep 12, 2006·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →