Inventor · disambiguated record
Po-Chih Huang
Also filed as: HUANG PO-CHIH
8 granted patents·5 pending applications·1 citations·filing 2020–2025
74Inventor score
Top patents by PatentIndex Score
13 records- 0185US2025364277A1Gas flow accelerator to prevent buildup of processing byproduct in a main pumping line of a semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0280US12482671B2Gas flow accelerator to prevent buildup of processing byproduct in a main pumping line of a semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 0379US2025349555A1Systems and methods for processing a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0478US11594401B2Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 28, 2023·1 cites·20 claims
- 0575US12249493B2Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 0671US2024379380A1Systems and methods for processing a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0767US2022384239A1Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0865US11972957B2Gas flow accelerator to prevent buildup of processing byproduct in a main pumping line of a semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·20 claims
- 0964US12394635B2Systems and methods for processing a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 1062US2025326199A1Casing plateMICRO STAR INT’L CO LTD·Filed 2024·Application pending·0 cites
- 1159US12055228B2Valve for throttling gas flow from a semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1255US12283514B2Method and system for processing waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 22, 2025·0 cites·20 claims
- 1352US12378995B2Linear guide, carriage, end cap and method for lubricationEwellix AB·Filed 2022·Granted Aug 5, 2025·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →