Inventor · disambiguated record
Kei Sakai
Also filed as: SAKAI KEI
30 granted patents·3 pending applications·55 citations·filing 2008–2023
94Inventor score
Files withHITACHI HIGH TECH CORP23MITSUBISHI HEAVY IND LTD4IDEN HIROSHI2SAKAI KEI2ISHIJIMA TATSUAKI1
Top patents by PatentIndex Score
33 records- 0178US9336587B2Semiconductor circuit pattern measuring apparatus and methodHITACHI HIGH TECH CORP·Filed 2013·Granted May 10, 2016·5 cites·11 claims
- 0278US7650222B2Method and device for integrative control of gas engineMITSUBISHI HEAVY IND LTD·Filed 2008·Granted Jan 19, 2010·11 cites·16 claims
- 0376US9024272B2Pattern measuring apparatusSAKAI KEI·Filed 2010·Granted May 5, 2015·6 cites·4 claims
- 0475US7747378B2Method and device for integrative control of gas engineMITSUBISHI HEAVY IND LTD·Filed 2008·Granted Jun 29, 2010·9 cites·9 claims
- 0574US7650223B2Method and device for integrative control of gas engineMITSUBISHI HEAVY IND LTD·Filed 2008·Granted Jan 19, 2010·9 cites·9 claims
- 0671US10620421B2Image-forming device, and dimension measurement deviceHITACHI HIGH TECH CORP·Filed 2018·Granted Apr 14, 2020·1 cites·5 claims
- 0771US9029045B2Gas diffusion electrode and production method for same; membrane electrode assembly and production method for sameSATOU KAZUYUKI·Filed 2010·Granted May 12, 2015·2 cites·32 claims
- 0870US10545017B2Overlay error measuring device and computer program for causing computer to measure patternHITACHI HIGH TECH CORP·Filed 2013·Granted Jan 28, 2020·2 cites·14 claims
- 0968US7654247B2Method and device for controlling starting of gas engineMITSUBISHI HEAVY IND LTD·Filed 2008·Granted Feb 2, 2010·7 cites·9 claims
- 1066US10976536B2Image-forming device, and dimension measurement deviceHITACHI HIGH TECH CORP·Filed 2020·Granted Apr 13, 2021·0 cites·6 claims
- 1166US10197783B2Image-forming device, and dimension measurement deviceHITACHI HIGH TECH CORP·Filed 2013·Granted Feb 5, 2019·1 cites·4 claims
- 1265US10984980B2Charged particle beam device for imaging vias inside trenchesHITACHI HIGH TECH CORP·Filed 2016·Granted Apr 20, 2021·1 cites·8 claims
- 1365US10417756B2Pattern measurement apparatus and defect inspection apparatusHITACHI HIGH TECH CORP·Filed 2015·Granted Sep 17, 2019·1 cites·5 claims
- 1457US11670481B2Charged particle beam deviceHITACHI HIGH TECH CORP·Filed 2021·Granted Jun 6, 2023·0 cites·14 claims
- 1555US11626266B2Charged particle beam deviceHITACHI HIGH TECH CORP·Filed 2021·Granted Apr 11, 2023·0 cites·7 claims
- 1655US11011346B2Electron beam device and image processing methodHITACHI HIGH TECH CORP·Filed 2020·Granted May 18, 2021·0 cites·13 claims
- 1755US8478078B2Pattern-searching condition determining method, and pattern-searching condition setting deviceSAKAI KEI·Filed 2009·Granted Jul 2, 2013·0 cites·8 claims
- 1854US2023314128A1Processing System and Charged Particle Beam ApparatusHITACHI HIGH TECH CORP·Filed 2023·Application pending·0 cites
- 1952US11170969B2Electron beam observation device, electron beam observation system, and control method of electron beam observation deviceHITACHI HIGH TECH CORP·Filed 2018·Granted Nov 9, 2021·0 cites·16 claims
- 2051US9589343B2Pattern measurement device, evaluation method of polymer compounds used in self-assembly lithography, and computer programHITACHI HIGH TECH CORP·Filed 2013·Granted Mar 7, 2017·0 cites·17 claims
- 2149US9831062B2Method for pattern measurement, method for setting device parameters of charged particle radiation device, and charged particle radiation deviceHITACHI HIGH TECH CORP·Filed 2014·Granted Nov 28, 2017·0 cites·10 claims
- 2248US12198327B2Measurement system, method for generating learning model to be used when performing image measurement of semiconductor including predetermined structure, and recording medium for storing program for causing computer to execute processing for generating learning model to be used when performing image measurement of semiconductor including predetermined structureHITACHI HIGH TECH CORP·Filed 2019·Granted Jan 14, 2025·0 cites·19 claims
- 2348US11791130B2Electron beam observation device, electron beam observation system, and image correcting method and method for calculating correction factor for image correction in electron beam observation deviceHITACHI HIGH TECH CORP·Filed 2019·Granted Oct 17, 2023·0 cites·28 claims
- 2446US12505976B2Charged particle beam apparatus and method for calculating roughness indexHITACHI HIGH TECH CORP·Filed 2020·Granted Dec 23, 2025·0 cites·14 claims
- 2546US12347074B2Pattern measurement system, pattern measurement method, and program for measuring edge roughness at the edge of a pattern based on a random noise componentHITACHI HIGH TECH CORP·Filed 2021·Granted Jul 1, 2025·0 cites·12 claims
- 2646US10665420B2Charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2019·Granted May 26, 2020·0 cites·11 claims
- 2745US2025014858A1Correction Method and Correction DeviceHITACHI HIGH TECH CORP·Filed 2021·Application pending·0 cites
- 2843US12463005B2Correction coefficient calculation device, correction coefficient calculation method, and correction coefficient calculation programHITACHI HIGH TECH CORP·Filed 2020·Granted Nov 4, 2025·0 cites·13 claims
- 2941US11177112B2Pattern measurement device and non-transitory computer readable medium having stored therein program for executing measurementHITACHI HIGH TECH CORP·Filed 2018·Granted Nov 16, 2021·0 cites·8 claims
- 3041US9799903B2Electrocatalyst for solid polymer fuel cellIDEN HIROSHI·Filed 2011·Granted Oct 24, 2017·0 cites·9 claims
- 3138US2012100461A1Hydrophilic porous layer for fuel cells, gas diffusion electrode and manufacturing method thereof, and membrane electrode assemblyIDEN HIROSHI·Filed 2010·Application pending·0 cites
- 3236US12354829B2Overlay measurement system and overlay measurement device for overlay error measurement using electron microscopyHITACHI HIGH TECH CORP·Filed 2019·Granted Jul 8, 2025·0 cites·34 claims
- 3332US9129775B2Specimen potential measuring method, and charged particle beam deviceISHIJIMA TATSUAKI·Filed 2010·Granted Sep 8, 2015·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →