Inventor · disambiguated record
Hsing-Fen Lo
Also filed as: LO HSING-FEN
17 granted patents·5 pending applications·33 citations·filing 2010–2021
89Inventor score
Top patents by PatentIndex Score
22 records- 0192US8089089B2Side-emitting LED package and manufacturing method of the sameKUO CHESTER·Filed 2010·Granted Jan 3, 2012·22 cites·20 claims
- 0272US8440477B1Method for manufacturing LEDLO HSING-FEN·Filed 2012·Granted May 14, 2013·4 cites·16 claims
- 0365US8507932B2LED unitKE CHIH-HSUN·Filed 2011·Granted Aug 13, 2013·2 cites·11 claims
- 0464US8946734B2Method for packaging light emitting diodes and light emitting module having LED packages formed by the methodLO HSING-FEN·Filed 2012·Granted Feb 3, 2015·2 cites·8 claims
- 0563US11556031B2Light emitting diode device, backlight module, and liquid crystal display device having sameADVANCED OPTOELECTRONIC TECH·Filed 2021·Granted Jan 17, 2023·0 cites·17 claims
- 0662US9184358B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Nov 10, 2015·1 cites·12 claims
- 0752US9899587B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Feb 20, 2018·0 cites·4 claims
- 0850US9620692B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Apr 11, 2017·0 cites·11 claims
- 0947US8921132B2Method for manufacturing LED packageADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Dec 30, 2014·0 cites·18 claims
- 1047US2014175482A1Light emitting diode package with light reflecting cup internally slantedADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 1146US8871535B2Method for manufacturing LEDADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Oct 28, 2014·0 cites·14 claims
- 1245US8828754B2Method for manufacturing LEDADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 9, 2014·0 cites·15 claims
- 1345US2013285093A1Light emitting diode package structure having a substrate including ceramic fibersTECHNOLOGY INC ADVANCED OPTOELECTRONIC·Filed 2012·Application pending·0 cites
- 1444US9318666B2Light emitting diode device and method for manufacturing sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Apr 19, 2016·0 cites·7 claims
- 1542US2013285097A1Side-view light emitting diode package and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 1642US2013069101A1Method for manufacturing led and led obtained therebyLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 1741US8536593B2LED device having two LED dies separated by a damLO HSING-FEN·Filed 2012·Granted Sep 17, 2013·0 cites·20 claims
- 1841US8449153B2LED moduleLO HSING-FEN·Filed 2011·Granted May 28, 2013·0 cites·14 claims
- 1941US2012025258A1Light emitting diode package and light emitting diode moduleCHAN SHIUN-WEI·Filed 2011·Application pending·0 cites
- 2032USD645830SHousing for light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Sep 27, 2011·1 cites·1 claims
- 2132USD645422SHousing for light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Sep 20, 2011·1 cites·1 claims
- 2229USD645423SHousing for light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Sep 20, 2011·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →