Inventor · disambiguated record
Akifumi Ueda
Also filed as: UEDA AKIFUMI
14 granted patents·11 citations·filing 1993–2013
86Inventor score
Top patents by PatentIndex Score
14 records- 0164US8049042B2Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymerMITSUBISHI RAYON CO·Filed 2009·Granted Nov 1, 2011·1 cites·13 claims
- 0259US8092979B2Resist polymer and resist compositionMOMOSE HIKARU·Filed 2009·Granted Jan 10, 2012·0 cites·41 claims
- 0356US9188857B2Resist polymer, process for production thereof, resist composition, and process for production of substrates with patterns thereonMITSUBISHI RAYON CO·Filed 2013·Granted Nov 17, 2015·0 cites·1 claims
- 0454US8580481B2Resist polymer and resist compositionMOMOSE HIKARU·Filed 2011·Granted Nov 12, 2013·0 cites·47 claims
- 0554US7575846B2Resist polymer and resist compositionMITSUBISHI RAYON CO·Filed 2004·Granted Aug 18, 2009·2 cites·15 claims
- 0652US8614283B2Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymerMOMOSE HIKARU·Filed 2011·Granted Dec 24, 2013·0 cites·11 claims
- 0749US8241829B2Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymerMOMOSE HIKARU·Filed 2005·Granted Aug 14, 2012·0 cites·14 claims
- 0846US8476401B2Resist polymer, process for production thereof, resist composition, and process for production of substrated with patterns thereonMOMOSE HIKARU·Filed 2005·Granted Jul 2, 2013·0 cites·2 claims
- 0943US5376500APolyester resin for a dye receptive layer of a recording medium for sublimation type heat-sensitive transfer recording process, and a recording medium using the polyester resinMITSUBISHI RAYON CO·Filed 1993·Granted Dec 27, 1994·3 cites·21 claims
- 1038US9625812B2Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing sameMICRO PROCESS INC·Filed 2013·Granted Apr 18, 2017·0 cites·9 claims
- 1136US8647806B2Photosensitive resin composition, photosensitive dry film and method for forming patternUEDA AKIFUMI·Filed 2010·Granted Feb 11, 2014·0 cites·7 claims
- 1234US8647807B2Photosensitive resin composition, photosensitive dry film and method for forming patternUEDA AKIFUMI·Filed 2010·Granted Feb 11, 2014·0 cites·10 claims
- 1333US5326741ARecording medium for sublimation type heat-sensitive transfer recording processMITSUBISHI RAYON CO·Filed 1993·Granted Jul 5, 1994·4 cites·21 claims
- 1429US5326742ARecording medium for sublimation type heat-sensitive transfer recording processMITSUBISHI RAYON CO·Filed 1993·Granted Jul 5, 1994·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →