Inventor · disambiguated record
Te-Wei Chen
Also filed as: CHEN TE-WEI
17 granted patents·16 pending applications·42 citations·filing 2000–2024
89Inventor score
Top patents by PatentIndex Score
33 records- 0185US6742157B2Decoding system and method in an optical disk storage deviceACER LABS INC·Filed 2001·Granted May 25, 2004·22 cites·6 claims
- 0282US8217494B2Electrostatic discharge protection deviceCHEN TE-WEI·Filed 2010·Granted Jul 10, 2012·8 cites·22 claims
- 0371US8314496B2Semiconductor device and inductorCHEN TE-WEI·Filed 2009·Granted Nov 20, 2012·6 cites·20 claims
- 0470US9696318B2Hydrophilic film, preparation method and applications thereof3M INNOVATIVE PROPERTIES CO·Filed 2013·Granted Jul 4, 2017·1 cites·19 claims
- 0565US8264479B2Display control device for flat panel displays and display device utilizing the sameCHEN TE-WEI·Filed 2009·Granted Sep 11, 2012·1 cites·20 claims
- 0654US7639024B2Resistance compensation circuit and method thereofSILICONMOTION INC·Filed 2006·Granted Dec 29, 2009·2 cites·6 claims
- 0754US2025371242A1Dynamic Chip Floorplanning MethodMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0853US12142873B2Electronic device and waterproof member thereofWISTRON NEWEB CORP·Filed 2022·Granted Nov 12, 2024·0 cites·8 claims
- 0952US7924039B2Self-cleaning package testing socketKING YUAN ELECTRONICS CO LTD·Filed 2009·Granted Apr 12, 2011·1 cites·8 claims
- 1052US7608894B2Electrostatic discharge protection deviceSILICON MOTION INC CN·Filed 2007·Granted Oct 27, 2009·1 cites·4 claims
- 1152US2023376671A1Learning-Based Placement of Flexible Circuit BlocksMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1251US2024311542A1Rectilinear-block placement method for early floorplan using reinforcement learningMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1351US2024303408A1Method and system for learning-based shaping flexible blocks on a chip canvas in integrated circuit (ic) designMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1450US9991196B2Printed circuit board and method of fabricating an elementSILICON MOTION INC·Filed 2017·Granted Jun 5, 2018·0 cites·10 claims
- 1549US12094727B2Method forming a semiconductor package deviceSILICON MOTION INC·Filed 2022·Granted Sep 17, 2024·0 cites·15 claims
- 1649US2018082939A1Printed circuit board and method of fabricating an elementSILICON MOTION INC·Filed 2017·Application pending·0 cites
- 1748US9312691B2ESD protection circuit and ESD protection method thereofSILICON MOTION INC·Filed 2014·Granted Apr 12, 2016·0 cites·26 claims
- 1846US10859630B2Test methods for packaged integrated circuitsSILICON MOTION INC·Filed 2017·Granted Dec 8, 2020·0 cites·17 claims
- 1945US2010006943A1Electrostatic discharge protection deviceSILICON MOTION INC CN·Filed 2009·Application pending·0 cites
- 2045US2010008003A1Electrostatic discharge protection deviceSILICON MOTION INC CN·Filed 2009·Application pending·0 cites
- 2144US7843672B2Input/Output regulating circuitry with self-electrostatic-discharge protectionSILICON MOTION INC·Filed 2008·Granted Nov 30, 2010·0 cites·6 claims
- 2244US2010178037A1Display apparatus, video generation apparatus, and method thereofCHEN TE-WEI·Filed 2009·Application pending·0 cites
- 2341US7760564B2Non-volatile memory structureSILICONMOTION INC·Filed 2009·Granted Jul 20, 2010·0 cites·6 claims
- 2440US2008012149A1Semiconductor chip structureSILICONMOTION INC·Filed 2006·Application pending·0 cites
- 2539US2007247771A1Analog Input/Output Circuit with ESD ProtectionSILICONMOTION INC·Filed 2006·Application pending·0 cites
- 2638US7512022B2Non-volatile memory structureSILICONMOTION INC·Filed 2006·Granted Mar 31, 2009·0 cites·10 claims
- 2738US2007007670A1Reworkable bond pad structureCHEN TE-WEI·Filed 2005·Application pending·0 cites
- 2837US2007040220A1An electrostatic discharge circuitSILICONMOTION INC·Filed 2005·Application pending·0 cites
- 2935US2010227401A1Media and processes for the ex vivo production of megakaryocytes from human cd34+ cellsFOOD INDUSTRY RES & DEV INST·Filed 2010·Application pending·0 cites
- 3033US2003132774A1Analogue signal testing system for integrated circuitFiled 2002·Application pending·0 cites
- 3132US6465864B2Diode structure on MOS waferFARADAY TECH CORP·Filed 2001·Granted Oct 15, 2002·0 cites·23 claims
- 3232US2019013292A1Methods for wire bonding and testing and flash memories fabricated by the sameSILICON MOTION INC·Filed 2018·Application pending·0 cites
- 3330US2002079539A1Method for fabricating an I/O pad with improved ESD toleranceFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →