Inventor · disambiguated record
Neill Thornton
Also filed as: THORNTON NEILL · THORNTON NEILL R
12 granted patents·5 pending applications·671 citations·filing 1988–2013
93Inventor score
Files withFAIRCHILD SEMICONDUCTOR4TYCO ELECTRONICS CORP4LANG DENNIS2THORNTON NEILL2MICROWAVE TECHNOLOGY INC1
Top patents by PatentIndex Score
17 records- 0195US6518731B2Devices and methods for protection of rechargeable elementsTYCO ELECTRONICS CORP·Filed 2001·Granted Feb 11, 2003·112 cites·31 claims
- 0295US4967245ATrench power MOSFET deviceSILICONIX INC·Filed 1988·Granted Oct 30, 1990·184 cites·4 claims
- 0394US6331763B1Devices and methods for protection of rechargeable elementsTYCO ELECTRONICS CORP·Filed 1999·Granted Dec 18, 2001·176 cites·39 claims
- 0492US7033891B2Trench gate laterally diffused MOSFET devices and methods for making such devicesFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Apr 25, 2006·71 cites·39 claims
- 0591US6914416B2Electrical device including a voltage regulator mounted on a variable resistorTYCO ELECTRONICS CORP·Filed 2002·Granted Jul 5, 2005·62 cites·3 claims
- 0679US7390698B2Packaged semiconductor device and method of manufacture using shaped dieFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Jun 24, 2008·8 cites·17 claims
- 0765US8030764B2High temperature operating package and circuit designFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Oct 4, 2011·2 cites·12 claims
- 0864US5321283AHigh frequency JFETMICROWAVE TECHNOLOGY INC·Filed 1991·Granted Jun 14, 1994·37 cites·65 claims
- 0962US7084488B2Packaged semiconductor device and method of manufacture using shaped dieFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Aug 1, 2006·10 cites·12 claims
- 1047US9844791B2Micronozzle atomizers and methods of manufacture and useUNIV OREGON STATE·Filed 2013·Granted Dec 19, 2017·0 cites·17 claims
- 1147US2005258805A1Devices and methods for protection of rechargeable elementsTYCO ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 1244US8803239B2High temperature operating package and circuit designTHORNTON NEILL·Filed 2011·Granted Aug 12, 2014·0 cites·6 claims
- 1344US5648664ABIFET vacuum tube replacement structureFiled 1995·Granted Jul 15, 1997·9 cites·10 claims
- 1442US2008054461A1Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor deviceLANG DENNIS·Filed 2007·Application pending·0 cites
- 1542US2013037634A1Micronozzle atomizers and methods of manufacture and useMILLER RICHARD T·Filed 2011·Application pending·0 cites
- 1641US2008054496A1High temperature operating package and circuit designTHORNTON NEILL·Filed 2006·Application pending·0 cites
- 1734US2010117231A1Reliable wafer-level chip-scale solder bump structureLANG DENNIS·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Neill Thornton files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →