Inventor · disambiguated record
Hirohisa Amago
Also filed as: AMAGO HIROHISA
6 granted patents·3 pending applications·69 citations·filing 1993–2025
77Inventor score
Top patents by PatentIndex Score
9 records- 0183US5402314APrinted circuit board having through-hole stopped with photo-curable solder resistSONY CORP·Filed 1993·Granted Mar 28, 1995·63 cites·5 claims
- 0278US2025360742A1Laminate, card, and housingSONY GROUP CORP·Filed 2025·Application pending·0 cites
- 0372US8193008B2Method of forming semiconductor thin film and semiconductor thin film inspection apparatusUMEZU NOBUHIKO·Filed 2009·Granted Jun 5, 2012·4 cites·20 claims
- 0470US12403711B2Laminate, card, and housingSONY GROUP CORP·Filed 2021·Granted Sep 2, 2025·0 cites·16 claims
- 0566US11993094B2Reversible recording medium and exterior memberSONY CORP·Filed 2019·Granted May 28, 2024·0 cites·19 claims
- 0665US12145388B2Recording medium and exterior memberSONY GROUP CORP·Filed 2020·Granted Nov 19, 2024·0 cites·24 claims
- 0758US8404498B2Method of inspecting semiconductor thin film by transmission imaging and inspection device for the sameAMAGO HIROHISA·Filed 2009·Granted Mar 26, 2013·2 cites·14 claims
- 0845US2012231559A1Method of forming semiconductor thin film and semiconductor thin film inspection apparatusUMEZU NOBUHIKO·Filed 2012·Application pending·0 cites
- 0935US2012111619A1Circuit substrate and manufacturing method of circuit substrateAMAGO HIROHISA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →