Inventor · disambiguated record
Hyojin Yun
Also filed as: YUN HYOJIN
9 granted patents·11 pending applications·4 citations·filing 2011–2025
77Inventor score
Top patents by PatentIndex Score
20 records- 0191US12176313B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 24, 2024·2 cites·14 claims
- 0277US2025323221A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0376US12360457B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0473US2025079378A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0572US9570304B2Method of forming fine patterns in an anti-reflection layer for use as a patterning hard maskSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·2 cites·19 claims
- 0666US12355005B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 0766US12044974B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 0861US2025316498A1Wiring structure manufacturing method and the wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0959US2025320262A1Novel variant regulator of acetate metabolism a and method of producing l-branched-chain amino acid using the sameCJ CHEILJEDANG CORP·Filed 2022·Application pending·0 cites
- 1059US2025087612A1Conductive structure, semiconductor chip including the same and manufacturing method of the conductive structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1157US2024352493A1Novel acetohydroxy acid synthase subunit variant and method for producing l-valine using sameCJ CHEILJEDANG CORP·Filed 2022·Application pending·0 cites
- 1255US2025293139A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1353US12400990B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1453US9158204B2Photo lithographic rinse solution and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·16 claims
- 1553US2024088094A1Semiconductor package and system including semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1651US2024105536A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1750US2023038603A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1845US2016026090A1Method of manufacturing a semiconductor device using photolithographic rinse solutionSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1930US8767203B2Plasma monitoring device using a cylindrical hollow electrodeKIM SE-YEON·Filed 2011·Granted Jul 1, 2014·0 cites·7 claims
- 2030US8475998B2Compound synthesis method, microarray, acid-transfer composition, and biochip compositionYUN HYOJIN·Filed 2011·Granted Jul 2, 2013·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →