Inventor · disambiguated record
Tomoyuki Kamakura
Also filed as: KAMAKURA TOMOYUKI
28 granted patents·16 pending applications·307 citations·filing 2003–2024
95Inventor score
Top patents by PatentIndex Score
44 records- 0194US10894289B2Manufacturing method for three-dimensional structure and manufacturing apparatus thereforSEIKO EPSON CORP·Filed 2016·Granted Jan 19, 2021·5 cites·17 claims
- 0293US7127810B2Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through maskSEIKO EPSON CORP·Filed 2003·Granted Oct 31, 2006·112 cites·18 claims
- 0387US7342354B2Organic EL display device, electronic equipment, and method for manufacturing the sameSEIKO EPSON CORP·Filed 2004·Granted Mar 11, 2008·47 cites·8 claims
- 0486US7795796B2Wiring substrate, electro optic device and electronic equipmentSEIKO EPSON CORP·Filed 2006·Granted Sep 14, 2010·9 cites·1 claims
- 0586US7526858B2Apparatus for making electronic devicesSEIKO EPSON CORP·Filed 2006·Granted May 5, 2009·17 cites·22 claims
- 0685US10911018B2Vibrator device and electronic apparatusSEIKO EPSON CORP·Filed 2020·Granted Feb 2, 2021·2 cites·9 claims
- 0782US9161450B2Electronic device, electronic apparatus, and method of manufacturing electronic deviceSEIKO EPSON CORP·Filed 2013·Granted Oct 13, 2015·6 cites·9 claims
- 0882US7029960B2Device manufacturing methodSEIKO EPSON CORP·Filed 2004·Granted Apr 18, 2006·23 cites·11 claims
- 0979US10717231B2Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2016·Granted Jul 21, 2020·1 cites·6 claims
- 1079US7090139B2IC card and method of manufacturing the sameSEIKO EPSON CORP·Filed 2003·Granted Aug 15, 2006·71 cites·7 claims
- 1178US12273092B2Resonator deviceSEIKO EPSON CORP·Filed 2024·Granted Apr 8, 2025·0 cites·5 claims
- 1278US10760892B2SensorSEIKO EPSON CORP·Filed 2018·Granted Sep 1, 2020·2 cites·9 claims
- 1378US10455695B2Stretchable circuit board and strain sensorSEIKO EPSON CORP·Filed 2018·Granted Oct 22, 2019·2 cites·16 claims
- 1476US10285266B2Detection deviceSEIKO EPSON CORP·Filed 2018·Granted May 7, 2019·2 cites·8 claims
- 1574US7408207B2Device manufacturing method and device, electro-optic device, and electronic equipmentSEIKO EPSON CORP·Filed 2005·Granted Aug 5, 2008·5 cites·7 claims
- 1672US11717984B2Manufacturing method for three-dimensional structure and manufacturing apparatus thereforSEIKO EPSON CORP·Filed 2020·Granted Aug 8, 2023·0 cites·17 claims
- 1769US9370106B2Method for producing package, method for producing electronic device, and electronic deviceSEIKO EPSON CORP·Filed 2013·Granted Jun 14, 2016·2 cites·9 claims
- 1868US12009801B2Resonator deviceSEIKO EPSON CORP·Filed 2021·Granted Jun 11, 2024·0 cites·5 claims
- 1968US10625339B2Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2019·Granted Apr 21, 2020·0 cites·5 claims
- 2065US2025079493A1Microorganism, microbial fuel cell composition, microbial fuel cell, microbial electrolysis cell composition, and microbial electrolysis cellTOKYO UNIV OF PHARMACY AND LIFE SCIENCES·Filed 2024·Application pending·0 cites
- 2164US2020198232A1Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2020·Application pending·0 cites
- 2262US10376957B2Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2016·Granted Aug 13, 2019·0 cites·7 claims
- 2362US9549481B2Method for producing base substrate, method for producing electronic device, base substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted Jan 17, 2017·1 cites·6 claims
- 2460US11894834B2Vibrator deviceSEIKO EPSON CORP·Filed 2021·Granted Feb 6, 2024·0 cites·8 claims
- 2556US12113508B2Resonator deviceSEIKO EPSON CORP·Filed 2021·Granted Oct 8, 2024·0 cites·12 claims
- 2655US11689183B2Resonator deviceSEIKO EPSON CORP·Filed 2022·Granted Jun 27, 2023·0 cites·4 claims
- 2753US12494399B2Method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2023·Granted Dec 9, 2025·0 cites·5 claims
- 2849US2024213952A1Resonator deviceSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 2947US10595780B2Wearable biological information sensing deviceSEIKO EPSON CORP·Filed 2017·Granted Mar 24, 2020·0 cites·8 claims
- 3045US7968420B2Manufacturing semiconductor device and method of manufacturing electronic apparatusSEIKO EPSON CORP·Filed 2007·Granted Jun 28, 2011·0 cites·16 claims
- 3145US2017021558A1Three-dimensionally shaped article and three-dimensionally shaping methodSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3244US2016271696A1Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3344US2017056974A1Three-dimensional forming device, three-dimensional forming method, and three-dimensional formed articleSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3443US2011180313A1Method of forming circuit interconnection, circuit board, and circuit interconnection film having film thickness larger than width thereofSEIKO EPSON CORP·Filed 2011·Application pending·0 cites
- 3543US2016101470A1Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 3643US2011174528A1Method of forming circuit interconnection, circuit board, and circuit interconnection film having film thickness larger than width thereofSEIKO EPSON CORP·Filed 2011·Application pending·0 cites
- 3742US2016089720A1Three-dimensional forming apparatus and three-dimensional forming methodSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 3841US2017151606A1Molding-material supplying mechanism and molding apparatusSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 3941US2017043433A1Molding apparatus and molding methodSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4040US2014009875A1Base substrate, electronic device, and electronic apparatusSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 4140US2016120051A1Package, manufacturing method of package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4238US10773309B2Three-dimensional production method for functional element structure body and functional element structure bodySEIKO EPSON CORP·Filed 2017·Granted Sep 15, 2020·0 cites·9 claims
- 4338US2011159207A1Method for producing build-up substrateSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 4434US2004209442A1Device manufacturing method and device, electro-optic device, and electronic equipmentSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →