Inventor · disambiguated record
Takahiro Roppongi
Also filed as: ROPPONGI TAKAHIRO
24 granted patents·4 pending applications·88 citations·filing 2000–2019
94Inventor score
Top patents by PatentIndex Score
28 records- 0189US10675719B2Joining member, solder material, solder paste, formed solder, flux coated material, and solder jointSENJU METAL INDUSTRY CO·Filed 2015·Granted Jun 9, 2020·3 cites·9 claims
- 0285US9668358B2Cu ballSENJU METAL INDUSTRY CO·Filed 2012·Granted May 30, 2017·7 cites·13 claims
- 0384US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0479US10137535B2Cu ball, Cu core ball, solder joint, solder paste, and solder foamSENJU METAL INDUSTRY CO·Filed 2014·Granted Nov 27, 2018·3 cites·16 claims
- 0578US9278409B2Core ball, solder paste, formed-solder, flux-coated core ball and solder jointSENJU METAL INDUSTRY CO·Filed 2015·Granted Mar 8, 2016·3 cites·21 claims
- 0674US10717157B2Solder material, solder paste, solder preform, solder joint and method of managing the solder materialSENJU METAL INDUSTRY CO·Filed 2014·Granted Jul 21, 2020·1 cites·12 claims
- 0774US10322472B2Cu core ball, solder paste, formed solder, Cu core column, and solder jointSENJU METAL INDUSTRY CO·Filed 2014·Granted Jun 18, 2019·3 cites·5 claims
- 0873US10639749B2Cu core ball, solder joint, solder paste and formed solderSENJU METAL INDUSTRY CO·Filed 2019·Granted May 5, 2020·2 cites·16 claims
- 0972US11344976B2Solder material, solder paste, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Granted May 31, 2022·1 cites·19 claims
- 1069US7132020B2Solder for use on surfaces coated with nickel by electroless platingSENJU METAL INDUSTRY CO·Filed 2003·Granted Nov 7, 2006·13 cites·9 claims
- 1168US10381319B2Core material, semiconductor package, and forming method of bump electrodeSENJU METAL INDUSTRY CO·Filed 2017·Granted Aug 13, 2019·1 cites·20 claims
- 1264US10173287B2Solder material, solder joint, and method of manufacturing the solder materialSENJU METAL INDUSTRY CO·Filed 2014·Granted Jan 8, 2019·0 cites·6 claims
- 1363US10888957B2Soldering materialSENJU METAL INDUSTRY CO·Filed 2016·Granted Jan 12, 2021·1 cites·7 claims
- 1461US9266196B2Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag pasteSENJU METAL INDUSTRY CO·Filed 2015·Granted Feb 23, 2016·1 cites·39 claims
- 1561US6387499B1Coated solder spheres and method for producing the sameSENJU METAL INDUSTRY CO·Filed 2000·Granted May 14, 2002·9 cites·9 claims
- 1660US10147695B2Cu core ballSENJU METAL INDUSTRY CO·Filed 2013·Granted Dec 4, 2018·1 cites·8 claims
- 1760US9802251B2Ni ball, Ni core ball, solder joint, solder paste, and solder foamSENJU METAL INDUSTRY CO·Filed 2014·Granted Oct 31, 2017·0 cites·16 claims
- 1856US7750475B2Lead-free solder ballSENJU METAL INDUSTRY CO·Filed 2004·Granted Jul 6, 2010·7 cites·8 claims
- 1953US10610979B2Flux composition for solder applicationsSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 7, 2020·0 cites·2 claims
- 2052US10370771B2Method of manufacturing cu core ballSENJU METAL INDUSTRY CO·Filed 2017·Granted Aug 6, 2019·0 cites·11 claims
- 2149US10811376B2Cu column, Cu core column, solder joint, and through-silicon viaSENJU METAL INDUSTRY CO·Filed 2014·Granted Oct 20, 2020·0 cites·19 claims
- 2248US10888959B2Cu core ball, solder joint, solder paste and formed solderSENJU METAL INDUSTRY CO·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 2347US10150185B2Method for producing metal ball, joining material, and metal ballSENJU METAL INDUSTRY CO·Filed 2014·Granted Dec 11, 2018·0 cites·16 claims
- 2445US2020061757A1Solder material, solder paste, formed solder and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 2544US2015209912A1Cu CORE BALL, SOLDER PASTE AND SOLDER JOINTSENJU METAL LNDUSTRY CO LTD·Filed 2015·Application pending·0 cites
- 2643USRE45537ECoated solder spheres and method for producing the sameSOHMA DAISUKE·Filed 2010·Granted Jun 2, 2015·0 cites·23 claims
- 2742US2015336216A1Cu BALLSENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
- 2840US2019376161A1Cu Core Ball, Solder Joint, Solder Paste and Formed SolderSENJU METAL INDUSTRY CO·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →