Inventor · disambiguated record
Tsung-Cheng Chan
Also filed as: CHAN TSUNG-CHENG
5 granted patents·2 pending applications·3 citations·filing 2012–2018
66Inventor score
Top patents by PatentIndex Score
7 records- 0163US8420185B1Method for forming metal film with twinsCHUEH YU-LUN·Filed 2012·Granted Apr 16, 2013·3 cites·8 claims
- 0260US10475742B2Method for forming semiconductor device structure having conductive structure with twin boundariesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 0357US10283450B2Method for forming semiconductor device structure having conductive structure with twin boundariesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·21 claims
- 0453US9761523B2Interconnect structure with twin boundaries and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 12, 2017·0 cites·20 claims
- 0547US9023663B2Method for preparing nano-sheet array structure of group V-VI semiconductorNAT UNIV TSING HUA·Filed 2014·Granted May 5, 2015·0 cites·10 claims
- 0646US2013270121A1Method for fabricating copper nanowire with high density twinsNAT UNIV TSING HUA·Filed 2013·Application pending·0 cites
- 0734US2017207194A1Chip package and method for forming the sameXINTEC INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →