Inventor · disambiguated record
Suebphong Yenrudee
Also filed as: YENRUDEE SUEBPHONG
16 granted patents·19 citations·filing 2010–2019
90Inventor score
Top patents by PatentIndex Score
16 records- 0191US9805955B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Oct 31, 2017·5 cites·15 claims
- 0286US9922843B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 20, 2018·3 cites·16 claims
- 0385US10242953B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 26, 2019·7 cites·20 claims
- 0476US10163658B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Dec 25, 2018·1 cites·13 claims
- 0570US9449900B2Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflowSIRINORAKUL SARAVUTH·Filed 2010·Granted Sep 20, 2016·3 cites·13 claims
- 0661US10734247B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 4, 2020·0 cites·17 claims
- 0761US10325782B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jun 18, 2019·0 cites·16 claims
- 0860US10096490B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Oct 9, 2018·0 cites·14 claims
- 0960US10032645B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Jul 24, 2018·0 cites·16 claims
- 1060US9917038B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 13, 2018·0 cites·15 claims
- 1154US10361146B2Semiconductor package with multiple stacked leadframes and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Jul 23, 2019·0 cites·14 claims
- 1253US10276477B1Semiconductor package with multiple stacked leadframes and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 1353US10269686B1Method of improving adhesion between molding compounds and an apparatus thereofUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
- 1452US10600741B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Mar 24, 2020·0 cites·18 claims
- 1552US9029198B2Methods of manufacturing semiconductor devices including terminals with internal routing interconnectionsUTAC THAI LTD·Filed 2013·Granted May 12, 2015·0 cites·24 claims
- 1652US9000590B2Protruding terminals with internal routing interconnections semiconductor deviceUTAC THAI LTD·Filed 2013·Granted Apr 7, 2015·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →