Inventor · disambiguated record
Wang-Pen Mo
Also filed as: MO WANG-PEN
15 granted patents·1 pending application·200 citations·filing 2011–2016
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG5CHEN CHUN-CHANG4TAIWAN SEMICONDUCTOR MFG CO LTD3CHANG CHUN-WEI1WANG CHIH-CHIEN1
Top patents by PatentIndex Score
16 records- 0198US9875892B2Method of forming a photoresist layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·70 cites·20 claims
- 0297US9028915B2Method of forming a photoresist layerCHANG CHUN-WEI·Filed 2012·Granted May 12, 2015·111 cites·16 claims
- 0389US8940574B2Metal grid in backside illumination image sensor chips and methods for forming the sameWANG CHIH-CHIEN·Filed 2012·Granted Jan 27, 2015·8 cites·22 claims
- 0479US9153620B2Method of fabricating a metal grid for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 6, 2015·2 cites·20 claims
- 0578US9349662B2Test structure placement on a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 24, 2016·5 cites·14 claims
- 0677US9285677B2Lithography process on high topology featuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·2 cites·20 claims
- 0767US9651869B2Film portion at wafer edgeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·1 cites·20 claims
- 0866US9372406B2Film portion at wafer edgeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 21, 2016·1 cites·18 claims
- 0953US9791775B2Lithography process on high topology featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·0 cites·20 claims
- 1045US8759225B2Method to form a CMOS image sensorWANG CHUNG CHIEN·Filed 2012·Granted Jun 24, 2014·0 cites·20 claims
- 1142US9360755B2Thickening phase for spin coating processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 7, 2016·0 cites·20 claims
- 1242US8883403B2Method of semiconductor integrated circuit fabricationCHEN CHUN-CHANG·Filed 2012·Granted Nov 11, 2014·0 cites·20 claims
- 1342US8771534B2Manufacturing techniques for workpieces with varying topographiesCHEN CHUN-CHANG·Filed 2012·Granted Jul 8, 2014·0 cites·16 claims
- 1440US8692296B2Semiconductor devices and manufacturing methods thereofCHEN CHUN-CHANG·Filed 2012·Granted Apr 8, 2014·0 cites·20 claims
- 1539US8623229B2Manufacturing techniques to limit damage on workpiece with varying topographiesCHEN CHUN-CHANG·Filed 2011·Granted Jan 7, 2014·0 cites·11 claims
- 1637US2013302985A1Method of removing residue during semiconductor device fabricationWU CHUN-CHANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →