Inventor · disambiguated record
Wen-Ti Lin
Also filed as: LIN WEN-TI
6 granted patents·195 citations·filing 2002–2011
85Inventor score
Top patents by PatentIndex Score
6 records- 0196US7300865B2Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesiveIND TECH RES INST·Filed 2005·Granted Nov 27, 2007·53 cites·10 claims
- 0293US6919642B2Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formedIND TECH RES INST·Filed 2002·Granted Jul 19, 2005·66 cites·13 claims
- 0384US6830981B2Vertical nanotube transistor and process for fabricating the sameIND TECH RES INST·Filed 2002·Granted Dec 14, 2004·43 cites·14 claims
- 0480US6605491B1Method for bonding IC chips to substrates with non-conductive adhesiveIND TECH RES INST·Filed 2002·Granted Aug 12, 2003·30 cites·12 claims
- 0562US7595467B2Fault detection system and method for managing the samePROMOS TECHNOLOGIES INC·Filed 2005·Granted Sep 29, 2009·3 cites·12 claims
- 0624US8421858B2Inspection machine, inspecting method and inspecting systemHSIEH HSIAO-LIANG·Filed 2011·Granted Apr 16, 2013·0 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →