Inventor · disambiguated record
Eiju Maehara
Also filed as: MAEHARA EIJU
33 granted patents·6 pending applications·940 citations·filing 1996–2005
98Inventor score
Files withSANYO ELECTRIC CO33MAEHARA EIJU1SANYO ELECTRIC CO LTD A JAPAN1SANYO ELECTRIC CO LTD A OSAKA1
Top patents by PatentIndex Score
39 records- 0197US6548328B1Circuit device and manufacturing method of circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted Apr 15, 2003·128 cites·25 claims
- 0295US6562660B1Method of manufacturing the circuit device and circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted May 13, 2003·121 cites·29 claims
- 0392US6462418B2Semiconductor device having improved heat radiationSANYO ELECTRIC CO·Filed 2001·Granted Oct 8, 2002·63 cites·7 claims
- 0491US5834977AAmplifying circuit with power supply switching circuitSANYO ELECTRIC CO·Filed 1996·Granted Nov 10, 1998·81 cites·9 claims
- 0590US6706547B2Method of manufacturing a circuit device with trenches in a conductive foilSANYO ELECTRIC CO·Filed 2001·Granted Mar 16, 2004·47 cites·21 claims
- 0690US6545364B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2001·Granted Apr 8, 2003·63 cites·10 claims
- 0789US6975022B2Board for manufacturing a BGA and method of manufacturing semiconductor device using thereofSANYO ELECTRIC CO·Filed 2001·Granted Dec 13, 2005·50 cites·21 claims
- 0886US6528879B2Semiconductor device and semiconductor moduleSANYO ELECTRIC CO·Filed 2001·Granted Mar 4, 2003·43 cites·24 claims
- 0982US7276793B2Semiconductor device and semiconductor moduleSANYO ELECTRIC CO·Filed 2005·Granted Oct 2, 2007·9 cites·23 claims
- 1082US6909178B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2003·Granted Jun 21, 2005·27 cites·16 claims
- 1179US6531370B2Method for manufacturing circuit devicesSANYO ELECTRIC CO·Filed 2001·Granted Mar 11, 2003·27 cites·32 claims
- 1278US7125798B2Circuit device and manufacturing method of circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted Oct 24, 2006·20 cites·10 claims
- 1378US6812410B2Semiconductor module and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2001·Granted Nov 2, 2004·21 cites·17 claims
- 1476US6756610B2Light irradiating deviceSANYO ELECTRIC CO·Filed 2003·Granted Jun 29, 2004·18 cites·13 claims
- 1576US6534330B2Light irradiating device manufacturing methodSANYO ELECTRIC CO·Filed 2001·Granted Mar 18, 2003·23 cites·22 claims
- 1675US7220921B1Sheet-like board member and method of manufacturing a semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted May 22, 2007·22 cites·6 claims
- 1774US7173336B2Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted Feb 6, 2007·17 cites·5 claims
- 1874US6635956B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2002·Granted Oct 21, 2003·18 cites·4 claims
- 1973US6624511B2Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2001·Granted Sep 23, 2003·18 cites·19 claims
- 2072US7091606B2Circuit device and manufacturing method of circuit device and semiconductor moduleSANYO ELECTRIC CO·Filed 2003·Granted Aug 15, 2006·19 cites·25 claims
- 2170US6791199B2Heat radiating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Sep 14, 2004·16 cites·28 claims
- 2269US6501162B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2001·Granted Dec 31, 2002·13 cites·36 claims
- 2367US6646331B2Semiconductor device and semiconductor moduleSANYO ELECTRIC CO·Filed 2001·Granted Nov 11, 2003·10 cites·34 claims
- 2464US6558970B2Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating deviceSANYO ELECTRIC CO·Filed 2001·Granted May 6, 2003·10 cites·20 claims
- 2563US7138296B2Board for manufacturing a BGA and method of manufacturing semiconductor device using thereofSANYO ELECTRIC CO·Filed 2004·Granted Nov 21, 2006·9 cites·6 claims
- 2663US6933604B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2001·Granted Aug 23, 2005·11 cites·7 claims
- 2763US6864121B2Method of manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2001·Granted Mar 8, 2005·9 cites·27 claims
- 2862US6596564B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2002·Granted Jul 22, 2003·8 cites·2 claims
- 2958US7042087B2Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted May 9, 2006·7 cites·16 claims
- 3055US6967401B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2001·Granted Nov 22, 2005·6 cites·16 claims
- 3153US6894375B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2003·Granted May 17, 2005·1 cites·4 claims
- 3249US6963126B2Semiconductor device with under-fill material below a surface of a semiconductor chipSANYO ELECTRIC CO·Filed 2001·Granted Nov 8, 2005·3 cites·16 claims
- 3346US7093210B2Method of manufacturing circuit device using a communication networkSANYO ELECTRIC CO·Filed 2003·Granted Aug 15, 2006·2 cites·7 claims
- 3446US2005206014A1Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO LTD A OSAKA·Filed 2005·Application pending·0 cites
- 3543US2005056916A1Circuit device and manufacturing method of circuit deviceSANYO ELECTRIC CO LTD A JAPAN·Filed 2004·Application pending·0 cites
- 3643US2004066402A1Circuit device provision system and server computerFiled 2003·Application pending·0 cites
- 3736US2005206011A1Circuit moduleMAEHARA EIJU·Filed 2005·Application pending·0 cites
- 3836US2002041022A1Radiation substrate and semiconductor moduleFiled 2001·Application pending·0 cites
- 3936US2001026014A1Semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →