Inventor · disambiguated record
Yoshiyuki Morihiro
Also filed as: MORIHIRO YOSHIYUKI
10 granted patents·283 citations·filing 1979–1994
91Inventor score
Files withMITSUBISHI ELECTRIC CORP10
Top patents by PatentIndex Score
10 records- 0191US4914815AMethod for manufacturing hybrid integrated circuitsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Apr 10, 1990·101 cites·22 claims
- 0275US4685203AHybrid integrated circuit substrate and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Aug 11, 1987·22 cites·10 claims
- 0374US4629681AMethod of manufacturing multilayer circuit boardMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Dec 16, 1986·31 cites·7 claims
- 0473US4643798AComposite and circuit board having conductive layer on resin layer and method of manufacturingMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Feb 17, 1987·33 cites·14 claims
- 0572US4291758APreparation of boiling heat transfer surfaceMITSUBISHI ELECTRIC CORP·Filed 1979·Granted Sep 29, 1981·30 cites·3 claims
- 0660US4752555AMethod of manufacturing multilayer circuit boardMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Jun 21, 1988·25 cites·7 claims
- 0758US4783642AHybrid integrated circuit substrate and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 8, 1988·14 cites·7 claims
- 0844US5443659AFlux for soldering and solder composition comprising the same and soldering method using the sameMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 22, 1995·10 cites·19 claims
- 0940US5034569AMultilayer interconnection circuit boardMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jul 23, 1991·9 cites·6 claims
- 1034US5175399AWiring panel including wiring having a surface-reforming layer and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 29, 1992·8 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Yoshiyuki Morihiro files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →