Inventor · disambiguated record
Gabriel Hay Graham
Also filed as: GRAHAM GABRIEL · GRAHAM GABRIEL HAY
10 granted patents·6 pending applications·38 citations·filing 2015–2024
85Inventor score
Files withLAM RES CORP16
Top patents by PatentIndex Score
16 records- 0196US12157949B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2023·Granted Dec 3, 2024·1 cites·14 claims
- 0296US10094034B2Edge flow element for electroplating apparatusLAM RES CORP·Filed 2015·Granted Oct 9, 2018·11 cites·14 claims
- 0394US10233556B2Dynamic modulation of cross flow manifold during electroplatingLAM RES CORP·Filed 2016·Granted Mar 19, 2019·7 cites·19 claims
- 0492US11585007B2Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2019·Granted Feb 21, 2023·2 cites·7 claims
- 0592US9988733B2Apparatus and method for modulating azimuthal uniformity in electroplatingLAM RES CORP·Filed 2015·Granted Jun 5, 2018·3 cites·11 claims
- 0689US10094035B1Convection optimization for mixed feature electroplatingLAM RES CORP·Filed 2017·Granted Oct 9, 2018·14 cites·19 claims
- 0788US2025051953A1Cross flow conduit for foaming prevention in high convection plating cellsLAM RES CORP·Filed 2024·Application pending·0 cites
- 0870US11746435B2Removing bubbles from plating cellsLAM RES CORP·Filed 2021·Granted Sep 5, 2023·0 cites·39 claims
- 0970US10655240B2Removing bubbles from plating cellsLAM RES CORP·Filed 2018·Granted May 19, 2020·0 cites·37 claims
- 1066US2018312991A1Apparatus and method for modulating azimuthal uniformity in electroplatingLAM RES CORP·Filed 2018·Application pending·0 cites
- 1164US11214887B2Removing bubbles from plating cellLAM RES CORP·Filed 2020·Granted Jan 4, 2022·0 cites·38 claims
- 1258US12281402B2Low angle membrane frame for an electroplating cellLAM RES CORP·Filed 2020·Granted Apr 22, 2025·0 cites·20 claims
- 1358US2024076795A1Spatially and dimensionally non-uniform channelled plate for tailored hydrodynamics during electroplatingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1451US2024141541A1Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrateLAM RES CORP·Filed 2022·Application pending·0 cites
- 1550US2025179680A1Gap characterization in electrodeposition toolLAM RES CORP·Filed 2023·Application pending·0 cites
- 1645US2018258546A1Electroplating apparatus and methods utilizing independent control of impinging electrolyteLAM RES CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →