Inventor · disambiguated record
Hyun-Gyu Jang
Also filed as: JANG HYUN C · JANG HYUN GYU
8 granted patents·7 pending applications·7 citations·filing 2006–2023
74Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST11COUPANG CORP2ELECTRONICS AND TELECOMMUNCATIONS RES INST1KOREA ELECTRONICS TELECOMM1
Top patents by PatentIndex Score
15 records- 0187US9748941B2Power semiconductor module and method for stabilizing thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Granted Aug 29, 2017·6 cites·10 claims
- 0261US9800181B2Hybrid diode deviceELECTRONICS AND TELECOMMUNCATIONS RES INST·Filed 2016·Granted Oct 24, 2017·1 cites·20 claims
- 0356US10848074B2High voltage bridge rectifierELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Nov 24, 2020·0 cites·14 claims
- 0453US2023231404A1Semiconductor pre-charger module in battery systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 0548US2022198541A1Computing apparatus for providing item sales information and method thereofCOUPANG CORP·Filed 2021·Application pending·0 cites
- 0646US11710170B2Method of providing sale-related information and electronic device using the sameCOUPANG CORP·Filed 2021·Granted Jul 25, 2023·0 cites·16 claims
- 0745US2007134756A1Method and system of verifying protein-protein interaction using text miningKOREA ELECTRONICS TELECOMM·Filed 2006·Application pending·0 cites
- 0845US2022299554A1Apparatus for electrostatic discharge testELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 0945US2022020671A1Flip-stack type semiconductor package and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1044US11637192B2Metal oxide semiconductor-controlled thyristor device having uniform turn-off characteristic and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 25, 2023·0 cites·9 claims
- 1144US2021335681A1Ceramic stacked semiconductor package having improved anti-humidity and reliability and method of packaging ceramic stacked semiconductorELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1242US11784247B2MOS(metal oxide silicon) controlled thyristor deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 1340US10014401B2Semiconductor device with passivation layer for control of leakage currentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2017·Granted Jul 3, 2018·0 cites·16 claims
- 1440US9905654B2Bridge diodeELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Granted Feb 27, 2018·0 cites·14 claims
- 1534US2017062385A1Power converting deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hyun-Gyu Jang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →