Inventor · disambiguated record
Kun Sik Park
Also filed as: PARK KUN SIK
14 granted patents·7 pending applications·49 citations·filing 1999–2023
88Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST7KOREA ELECTRONICS TELECOMM6HYUNDAI ELECTRONICS IND3DO LEE MI1KIM DONG-PYO1
Top patents by PatentIndex Score
21 records- 0176US6384438B2Capacitor and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2001·Granted May 7, 2002·22 cites·5 claims
- 0267US7994553B2CMOS-based planar type silicon avalanche photo diode using silicon epitaxial layer and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2008·Granted Aug 9, 2011·1 cites·3 claims
- 0366US7141464B2Method of fabricating T-type gateKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Nov 28, 2006·4 cites·9 claims
- 0459US8486830B2Via forming method and method of manufacturing multi-chip package using the sameKIM DONG PYO·Filed 2010·Granted Jul 16, 2013·1 cites·20 claims
- 0558US7855366B2Bipolar junction transistor-based uncooled infrared sensor and manufacturing method thereofKOREA ELECTRONICS TELECOMM·Filed 2008·Granted Dec 21, 2010·1 cites·4 claims
- 0653US2023231404A1Semiconductor pre-charger module in battery systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 0745US8513655B2Organic light emitting diode and manufacturing method thereofDO LEE MI·Filed 2010·Granted Aug 20, 2013·0 cites·15 claims
- 0845US2022299554A1Apparatus for electrostatic discharge testELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 0945US2022020671A1Flip-stack type semiconductor package and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1044US11637192B2Metal oxide semiconductor-controlled thyristor device having uniform turn-off characteristic and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 25, 2023·0 cites·9 claims
- 1144US6297084B1Method for fabricating semiconductor memoryHYUNDAI ELECTRONICS IND·Filed 1999·Granted Oct 2, 2001·11 cites·19 claims
- 1244US2021335681A1Ceramic stacked semiconductor package having improved anti-humidity and reliability and method of packaging ceramic stacked semiconductorELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1342US11784247B2MOS(metal oxide silicon) controlled thyristor deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 1442US8981937B2RFID tagPARK JI MAN·Filed 2011·Granted Mar 17, 2015·0 cites·15 claims
- 1542US2012057106A1Polarizer and liquid crystal displayPARK KUN SIK·Filed 2011·Application pending·0 cites
- 1641US6284551B1Capacitor and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 1999·Granted Sep 4, 2001·9 cites·7 claims
- 1740US7190432B2Exposure apparatusKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Mar 13, 2007·0 cites·8 claims
- 1838US2011147468A1Rfid tagKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 1937US9171621B2Non-volatile memory (NVM) and method for manufacturing thereofKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Oct 27, 2015·0 cites·13 claims
- 2028US6319768B1Method for fabricating capacitor in dram cellLG SEMICON CO LTD·Filed 1999·Granted Nov 20, 2001·0 cites·10 claims
- 2126US2016284872A1Schottky diodeELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →