Inventor · disambiguated record
Takashi Oinoue
Also filed as: OINOUE TAKASHI
12 granted patents·8 pending applications·22 citations·filing 2014–2024
86Inventor score
Top patents by PatentIndex Score
20 records- 0194US10515988B2Solid-state image sensing device and electronic deviceSONY CORP·Filed 2016·Granted Dec 24, 2019·10 cites·17 claims
- 0291US11289525B2Solid-state imaging device and electronic apparatusSONY CORP·Filed 2016·Granted Mar 29, 2022·7 cites·10 claims
- 0385US11194135B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 7, 2021·2 cites·8 claims
- 0481US10379323B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 13, 2019·1 cites·21 claims
- 0578US11525984B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·14 claims
- 0677US2024332335A1Solid-state imaging device and electronic apparatusSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 0775US10622404B2Imaging device, manufacturing method, and substrate dividing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Apr 14, 2020·2 cites·11 claims
- 0874US12294010B2Solid-state image sensing device and electronic deviceSONY GROUP CORP·Filed 2023·Granted May 6, 2025·0 cites·15 claims
- 0973US12046621B2Solid-state imaging device and electronic apparatus to enhance image qualitySONY GROUP CORP·Filed 2022·Granted Jul 23, 2024·0 cites·11 claims
- 1068US11637135B2Solid-state image sensing device and electronic deviceSONY GROUP CORP·Filed 2021·Granted Apr 25, 2023·0 cites·17 claims
- 1168US2022157873A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 1265US11587970B2Imaging device, manufacturing method, and substrate dividing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 1365US11217612B2Solid-state image sensing device and electronic deviceSONY CORP·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 1455US2025386614A1Semiconductor device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 1555US2016284753A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2014·Application pending·0 cites
- 1654US2023170377A1Imaging device, manufacturing method, and substrate dividing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 1751US2024290813A1Optical detection device, manufacturing method of optical detection device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1851US2025120205A1Optical detecting device, manufacturing method therefor, and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1951US2017263665A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2017·Application pending·0 cites
- 2047US10070086B2Solid-state imaging device, method of manufacturing the same, and electronic deviceSONY CORP·Filed 2015·Granted Sep 4, 2018·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →