Inventor · disambiguated record
Fay Hua
Also filed as: HUA FAY
49 granted patents·12 pending applications·895 citations·filing 1998–2021
98Inventor score
Files withINTEL CORP48HUA FAY6NINGBO S J ELECTRONICS CO LTD2AGILENT TECHNOLOGIES INC1FITZGERALD TOM1
Top patents by PatentIndex Score
61 records- 0197US11222863B2Techniques for die stacking and associated configurationsINTEL CORP·Filed 2016·Granted Jan 11, 2022·21 cites·16 claims
- 0297US7391112B2Capping copper bumpsINTEL CORP·Filed 2005·Granted Jun 24, 2008·91 cites·6 claims
- 0394US10697065B2Sam assisted selective e-less plating on packaging materialsINTEL CORP·Filed 2016·Granted Jun 30, 2020·19 cites·17 claims
- 0494US8441118B2Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packagesHUA FAY·Filed 2009·Granted May 14, 2013·37 cites·3 claims
- 0594US6504242B1Electronic assembly having a wetting layer on a thermally conductive heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·128 cites·31 claims
- 0694US6504723B1Electronic assembly having solder thermal interface between a die substrate and a heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·56 cites·15 claims
- 0793US7886813B2Thermal interface material with carbon nanotubes and particlesINTEL CORP·Filed 2005·Granted Feb 15, 2011·29 cites·22 claims
- 0891US7524351B2Nano-sized metals and alloys, and methods of assembling packages containing sameINTEL CORP·Filed 2004·Granted Apr 28, 2009·54 cites·5 claims
- 0991US7102226B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2005·Granted Sep 5, 2006·18 cites·8 claims
- 1089US7615476B2Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packagesINTEL CORP·Filed 2005·Granted Nov 10, 2009·15 cites·11 claims
- 1188US7362580B2Electronic assembly having an indium wetting layer on a thermally conductive bodyINTEL CORP·Filed 2004·Granted Apr 22, 2008·41 cites·20 claims
- 1288US6867978B2Integrated heat spreader package for heat transfer and for bond line thickness control and process of makingINTEL CORP·Filed 2002·Granted Mar 15, 2005·65 cites·14 claims
- 1388US6848172B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2001·Granted Feb 1, 2005·41 cites·10 claims
- 1487US7314819B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2005·Granted Jan 1, 2008·15 cites·23 claims
- 1585US8242602B2Composite solder TIM for electronic packageFITZGERALD TOM·Filed 2010·Granted Aug 14, 2012·8 cites·9 claims
- 1685US7122460B2Electromigration barrier layers for solder jointsINTEL CORP·Filed 2004·Granted Oct 17, 2006·29 cites·16 claims
- 1785US7036573B2Polymer with solder pre-coated fillers for thermal interface materialsINTEL CORP·Filed 2002·Granted May 2, 2006·27 cites·8 claims
- 1883US10304804B2System on package architecture including structures on die back sideINTEL CORP·Filed 2017·Granted May 28, 2019·3 cites·21 claims
- 1982US7776651B2Method for compensating for CTE mismatch using phase change lead-free super plastic soldersINTEL CORP·Filed 2005·Granted Aug 17, 2010·6 cites·11 claims
- 2080US7223695B2Methods to deposit metal alloy barrier layersINTEL CORP·Filed 2004·Granted May 29, 2007·18 cites·43 claims
- 2179US7256058B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2006·Granted Aug 14, 2007·6 cites·30 claims
- 2278US7439617B2Capillary underflow integral heat spreaderINTEL CORP·Filed 2006·Granted Oct 21, 2008·10 cites·21 claims
- 2377US7704798B2Electronic assemblies with hot spot cooling and methods relating theretoINTEL CORP·Filed 2008·Granted Apr 27, 2010·7 cites·19 claims
- 2477US6813153B2Polymer solder hybridINTEL CORP·Filed 2002·Granted Nov 2, 2004·23 cites·22 claims
- 2576US7960831B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2007·Granted Jun 14, 2011·7 cites·23 claims
- 2676US7489033B2Electronic assembly with hot spot coolingINTEL CORP·Filed 2006·Granted Feb 10, 2009·7 cites·13 claims
- 2775US9824962B1Local dense patch for board assembly utilizing laser structuring metallization processINTEL CORP·Filed 2016·Granted Nov 21, 2017·2 cites·24 claims
- 2875US7242097B2Electromigration barrier layers for solder jointsINTEL CORP·Filed 2003·Granted Jul 10, 2007·15 cites·14 claims
- 2974US7560373B1Low temperature solder metallurgy and process for packaging applications and structures formed therebyHUA FAY·Filed 2008·Granted Jul 14, 2009·5 cites·20 claims
- 3072US10304686B2Electronic devices with components formed by late binding using self-assembled monolayersINTEL CORP·Filed 2017·Granted May 28, 2019·1 cites·13 claims
- 3172US6817091B2Electronic assembly having solder thermal interface between a die substrate and a heat spreaderINTEL CORP·Filed 2002·Granted Nov 16, 2004·13 cites·7 claims
- 3267US7449780B2Apparatus to minimize thermal impedance using copper on die backsideINTEL CORP·Filed 2003·Granted Nov 11, 2008·11 cites·17 claims
- 3364US7164585B2Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jan 16, 2007·11 cites·17 claims
- 3463US7111771B2Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making sameINTEL CORP·Filed 2003·Granted Sep 26, 2006·9 cites·31 claims
- 3563US7081669B2Device and system for heat spreader with controlled thermal expansionINTEL CORP·Filed 2003·Granted Jul 25, 2006·10 cites·32 claims
- 3661US6857557B2Low temperature microelectronic die to substrate interconnectsINTEL CORP·Filed 2002·Granted Feb 22, 2005·8 cites·26 claims
- 3759US10777538B2System on package architecture including structures on die back sideINTEL CORP·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 3859US10734236B2Electronic devices with components formed by late binding using self-assembled monolayersINTEL CORP·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 3955US7816250B2Composite solder TIM for electronic packageINTEL CORP·Filed 2006·Granted Oct 19, 2010·0 cites·15 claims
- 4055US6214131B1Mixed solder pastes for low-temperature soldering processAGILENT TECHNOLOGIES INC·Filed 1998·Granted Apr 10, 2001·22 cites·19 claims
- 4154US7436058B2Reactive solder materialINTEL CORP·Filed 2002·Granted Oct 14, 2008·7 cites·9 claims
- 4253US9860988B2Solder contacts for socket assembliesINTEL CORP·Filed 2014·Granted Jan 2, 2018·0 cites·24 claims
- 4353US9406582B2Apparatus to minimize thermal impedance using copper on die backsideHUA FAY·Filed 2008·Granted Aug 2, 2016·0 cites·18 claims
- 4451US10321573B2Solder contacts for socket assembliesINTEL CORP·Filed 2017·Granted Jun 11, 2019·0 cites·22 claims
- 4550US10595410B2Non-planar on-package via capacitorINTEL CORP·Filed 2016·Granted Mar 17, 2020·0 cites·17 claims
- 4649US12074087B2Thermal interface material layer and use thereofNINGBO S J ELECTRONICS CO LTD·Filed 2020·Granted Aug 27, 2024·0 cites·14 claims
- 4749US7524754B2Interconnect shunt used for current distribution and reliability redundancyINTEL CORP·Filed 2005·Granted Apr 28, 2009·0 cites·12 claims
- 4849US2008153210A1Electronic assembly having an indium wetting layer on a thermally conductive bodyHUA FAY·Filed 2008·Application pending·0 cites
- 4947US2005029675A1Tin/indium lead-free solders for low stress chip attachmentFiled 2004·Application pending·0 cites
- 5045US2008293188A1Reactive solder materialHUA FAY·Filed 2008·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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