Inventor · disambiguated record
Carl Deppisch
Also filed as: DEPPISCH CARL · DEPPISCH CARL L · DEPPISCH CARL LUDWIG
42 granted patents·13 pending applications·721 citations·filing 1997–2024
98Inventor score
Top patents by PatentIndex Score
55 records- 0194US6504242B1Electronic assembly having a wetting layer on a thermally conductive heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·128 cites·31 claims
- 0294US6504723B1Electronic assembly having solder thermal interface between a die substrate and a heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·56 cites·15 claims
- 0391US7102226B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2005·Granted Sep 5, 2006·18 cites·8 claims
- 0491US6751099B2Coated heat spreadersINTEL CORP·Filed 2001·Granted Jun 15, 2004·47 cites·15 claims
- 0591US6471792B1Stress relaxation resistant brassOLIN CORP·Filed 1999·Granted Oct 29, 2002·53 cites·8 claims
- 0689US7955900B2Coated thermal interface in integrated circuit dieINTEL CORP·Filed 2006·Granted Jun 7, 2011·20 cites·17 claims
- 0788US10651108B2Foam compositeINTEL CORP·Filed 2016·Granted May 12, 2020·4 cites·7 claims
- 0888US7672132B2Electronic packaging apparatus and methodINTEL CORP·Filed 2006·Granted Mar 2, 2010·21 cites·28 claims
- 0988US7362580B2Electronic assembly having an indium wetting layer on a thermally conductive bodyINTEL CORP·Filed 2004·Granted Apr 22, 2008·41 cites·20 claims
- 1088US6867978B2Integrated heat spreader package for heat transfer and for bond line thickness control and process of makingINTEL CORP·Filed 2002·Granted Mar 15, 2005·65 cites·14 claims
- 1188US6848172B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2001·Granted Feb 1, 2005·41 cites·10 claims
- 1286US7821126B2Heat sink with preattached thermal interface material and method of making sameINTEL CORP·Filed 2008·Granted Oct 26, 2010·11 cites·12 claims
- 1385US8809181B2Multi-solder techniques and configurations for integrated circuit package assemblyINTEL CORP·Filed 2012·Granted Aug 19, 2014·7 cites·10 claims
- 1485US8242602B2Composite solder TIM for electronic packageFITZGERALD TOM·Filed 2010·Granted Aug 14, 2012·8 cites·9 claims
- 1585US7036573B2Polymer with solder pre-coated fillers for thermal interface materialsINTEL CORP·Filed 2002·Granted May 2, 2006·27 cites·8 claims
- 1684US8409929B2Forming a semiconductor package including a thermal interface materialRENAVIKAR MUKUL·Filed 2011·Granted Apr 2, 2013·7 cites·14 claims
- 1783US8550327B2Clad solder thermal interface materialDEPPISCH CARL L·Filed 2011·Granted Oct 8, 2013·7 cites·14 claims
- 1881US9330999B2Multi-component integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2014·Granted May 3, 2016·7 cites·11 claims
- 1979US7256058B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2006·Granted Aug 14, 2007·6 cites·30 claims
- 2078US7439617B2Capillary underflow integral heat spreaderINTEL CORP·Filed 2006·Granted Oct 21, 2008·10 cites·21 claims
- 2177US7704798B2Electronic assemblies with hot spot cooling and methods relating theretoINTEL CORP·Filed 2008·Granted Apr 27, 2010·7 cites·19 claims
- 2276US7489033B2Electronic assembly with hot spot coolingINTEL CORP·Filed 2006·Granted Feb 10, 2009·7 cites·13 claims
- 2375US9257405B2Multi-solder techniques and configurations for integrated circuit package assemblyINTEL CORP·Filed 2014·Granted Feb 9, 2016·3 cites·12 claims
- 2473US5853505AIron modified tin brassOLIN CORP·Filed 1997·Granted Dec 29, 1998·23 cites·12 claims
- 2572US6817091B2Electronic assembly having solder thermal interface between a die substrate and a heat spreaderINTEL CORP·Filed 2002·Granted Nov 16, 2004·13 cites·7 claims
- 2672US6132528AIron modified tin brassOLIN CORP·Filed 1998·Granted Oct 17, 2000·23 cites·21 claims
- 2771US8030757B2Forming a semiconductor package including a thermal interface materialINTEL CORP·Filed 2007·Granted Oct 4, 2011·4 cites·10 claims
- 2868US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 2965US7219421B2Method of a coating heat spreaderINTEL CORP·Filed 2004·Granted May 22, 2007·9 cites·15 claims
- 3064US8174113B2Methods of fabricating robust integrated heat spreader designs and structures formed therebyGUPTA ABHISHEK·Filed 2008·Granted May 8, 2012·2 cites·7 claims
- 3164US7164585B2Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jan 16, 2007·11 cites·17 claims
- 3263US7081669B2Device and system for heat spreader with controlled thermal expansionINTEL CORP·Filed 2003·Granted Jul 25, 2006·10 cites·32 claims
- 3362US9808875B2Methods of fabricating low melting point solder reinforced sealant and structures formed therebyINTEL CORP·Filed 2016·Granted Nov 7, 2017·0 cites·8 claims
- 3462US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 3560US7416922B2Heat sink with preattached thermal interface material and method of making sameINTEL CORP·Filed 2003·Granted Aug 26, 2008·7 cites·27 claims
- 3656US7160758B2Electronic packaging apparatus and methodINTEL CORP·Filed 2004·Granted Jan 9, 2007·7 cites·42 claims
- 3755US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 3855US9254532B2Methods of fabricating low melting point solder reinforced sealant and structures formed therebyKULKARNI DEEPAK V·Filed 2009·Granted Feb 9, 2016·0 cites·12 claims
- 3955US7816250B2Composite solder TIM for electronic packageINTEL CORP·Filed 2006·Granted Oct 19, 2010·0 cites·15 claims
- 4054US7436058B2Reactive solder materialINTEL CORP·Filed 2002·Granted Oct 14, 2008·7 cites·9 claims
- 4153US2011147438A1Clad solder thermal interface materialDEPPISCH CARL LUDWIG·Filed 2009·Application pending·0 cites
- 4252US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 4349US2008153210A1Electronic assembly having an indium wetting layer on a thermally conductive bodyHUA FAY·Filed 2008·Application pending·0 cites
- 4447US7494041B2In-situ alloyed solders, articles made thereby, and processes of making sameINTEL CORP·Filed 2004·Granted Feb 24, 2009·2 cites·15 claims
- 4545US2008293188A1Reactive solder materialHUA FAY·Filed 2008·Application pending·0 cites
- 4641US2007228112A1Method and arrangement for forming a microelectronic packageSHI WEI·Filed 2006·Application pending·0 cites
- 4741US2005157471A1Integrated heat spreader package for heat transfer and for bond line thickness control and process of makingINTEL CORP·Filed 2005·Application pending·0 cites
- 4839US2007035012A1Integrated solder and heat spreader fabricationDEPPISCH CARL L·Filed 2006·Application pending·0 cites
- 4938US2006060639A1Doped contact formationsBYRNE TIFFANY A·Filed 2004·Application pending·0 cites
- 5035US7727815B2Reactive gettering in phase change solders to inhibit oxidation at contact surfacesINTEL CORP·Filed 2004·Granted Jun 1, 2010·0 cites·15 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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