Inventor · disambiguated record
Lisa J. Jimarez
Also filed as: JIMAREZ LISA J · JIMAREZ LISA JEANINE
32 granted patents·1 pending application·827 citations·filing 1994–2007
98Inventor score
Top patents by PatentIndex Score
33 records- 0198US6497943B1Surface metal balancing to reduce chip carrier flexingIBM·Filed 2000·Granted Dec 24, 2002·162 cites·17 claims
- 0292US6059170AMethod and apparatus for insulating moisture sensitive PBGA'sIBM·Filed 1998·Granted May 9, 2000·94 cites·48 claims
- 0391US6638607B1Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2002·Granted Oct 28, 2003·40 cites·9 claims
- 0489US6407334B1I/C chip assemblyIBM·Filed 2000·Granted Jun 18, 2002·35 cites·13 claims
- 0589US5847324AHigh performance electrical cableIBM·Filed 1996·Granted Dec 8, 1998·65 cites·8 claims
- 0687US6503821B2Integrated circuit chip carrier assemblyIBM·Filed 2001·Granted Jan 7, 2003·39 cites·30 claims
- 0786US6639155B1High performance packaging platform and method of making sameIBM·Filed 1997·Granted Oct 28, 2003·62 cites·13 claims
- 0886US6329713B1Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrateIBM·Filed 1998·Granted Dec 11, 2001·68 cites·33 claims
- 0980US6521842B2Hybrid surface mount and pin thru hole circuit boardIBM·Filed 2001·Granted Feb 18, 2003·40 cites·22 claims
- 1079US6757967B2Method of forming a chip assemblyIBM·Filed 2002·Granted Jul 6, 2004·18 cites·12 claims
- 1179US6486415B2Compliant layer for encapsulated columnsIBM·Filed 2001·Granted Nov 26, 2002·20 cites·2 claims
- 1276US6818972B2Reduction of chip carrier flexing during thermal cyclingIBM·Filed 2002·Granted Nov 16, 2004·16 cites·20 claims
- 1375US5509557ADepositing a conductive metal onto a substrateIBM·Filed 1994·Granted Apr 23, 1996·40 cites·22 claims
- 1471US6528179B1Reduction of chip carrier flexing during thermal cyclingIBM·Filed 2000·Granted Mar 4, 2003·12 cites·18 claims
- 1570US7303639B2Method for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2005·Granted Dec 4, 2007·3 cites·4 claims
- 1667US5909838AMethod of solder removalIBM·Filed 1997·Granted Jun 8, 1999·24 cites·22 claims
- 1762US7278207B2Method of making an electronic packageIBM·Filed 2005·Granted Oct 9, 2007·1 cites·5 claims
- 1860US6969436B2Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2003·Granted Nov 29, 2005·6 cites·18 claims
- 1954US6524888B2Method of attaching a conformal chip carrier to a flip chipIBM·Filed 2002·Granted Feb 25, 2003·6 cites·11 claims
- 2054US5560840ASelective etching of nickle/iron alloysIBM·Filed 1994·Granted Oct 1, 1996·12 cites·9 claims
- 2153US5989443ASelective etching of nickle/iron alloysIBM·Filed 1997·Granted Nov 23, 1999·7 cites·9 claims
- 2253US2007278654A1Method of making an electronic packageJIMAREZ LISA J·Filed 2007·Application pending·0 cites
- 2352US6961995B2Method of making an electronic packageIBM·Filed 2002·Granted Nov 8, 2005·3 cites·3 claims
- 2450US6734368B1Metal backed printed circuit board assembliesIBM·Filed 1997·Granted May 11, 2004·13 cites·24 claims
- 2548US5920037AConductive bonding design for metal backed circuitsIBM·Filed 1997·Granted Jul 6, 1999·10 cites·5 claims
- 2647US6836015B2Optical assemblies for transmitting and manipulating optical beamsIBM·Filed 2003·Granted Dec 28, 2004·1 cites·20 claims
- 2746US5723062ASelective etching of nickle/iron alloysIBM·Filed 1996·Granted Mar 3, 1998·8 cites·10 claims
- 2845US7718902B2Z interconnect structure and methodIBM·Filed 2004·Granted May 18, 2010·0 cites·20 claims
- 2942US6805280B2Z interconnect structure and methodIBM·Filed 2002·Granted Oct 19, 2004·0 cites·20 claims
- 3040US6355364B1Process of heat treating and annealing CIC and CIC created therebyIBM·Filed 1999·Granted Mar 12, 2002·9 cites·37 claims
- 3138US6337509B2Fixture for attaching a conformal chip carrier to a flip chipIBM·Filed 1998·Granted Jan 8, 2002·7 cites·11 claims
- 3235US5993579AHigh performance electrical cable and method of manufactureIBM·Filed 1997·Granted Nov 30, 1999·4 cites·6 claims
- 3332US6178630B1Conductive bonding design and method for aluminum backed circuitsIBM·Filed 1999·Granted Jan 30, 2001·2 cites·30 claims
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