Inventor · disambiguated record
Todd G. Backer
Also filed as: BACKER TODD · BACKER TODD G
3 granted patents·161 citations·filing 1991–1997
71Inventor score
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3 records- 0189US5665639AProcess for manufacturing a semiconductor device bump electrode using a rapid thermal annealCYPRESS SEMICONDUCTOR CORP·Filed 1994·Granted Sep 9, 1997·154 cites·27 claims
- 0244US5646804AThin film magnetic head having polymer on broken flux guide sections, method of producing and integrated structure incorporating samePHILIPS ELECTRONICS NA·Filed 1991·Granted Jul 8, 1997·6 cites·10 claims
- 0327US5946169ASoft adjacent layer vertically biased magnetoresistive sensor having improved sensor stabilitySEAGATE TECHNOLOGY·Filed 1997·Granted Aug 31, 1999·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →