Inventor · disambiguated record
Viswanadham Puligandla
Also filed as: PULIGANDLA VISWANADHAM
9 granted patents·2 pending applications·1,224 citations·filing 1982–2015
92Inventor score
Top patents by PatentIndex Score
11 records- 0198US6236115B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted May 22, 2001·342 cites·3 claims
- 0298US6187678B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted Feb 13, 2001·274 cites·16 claims
- 0398US6002177AHigh density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1995·Granted Dec 14, 1999·408 cites·20 claims
- 0489US5543585ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1994·Granted Aug 6, 1996·103 cites·21 claims
- 0587US8950162B2Multi-pane glass unit having seal with adhesive and hermetic coating layerMILLER SETH A·Filed 2011·Granted Feb 10, 2015·15 cites·20 claims
- 0685US5747101ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1996·Granted May 5, 1998·72 cites·15 claims
- 0772US9540863B2Multi-pane glass unit having seal with adhesive and gas-restrictive coating layerEVERSEALED WINDOWS INC·Filed 2015·Granted Jan 10, 2017·3 cites·17 claims
- 0836US2007080925A1Power generating display deviceNOKIA CORP·Filed 2005·Application pending·0 cites
- 0935US2004258556A1Lead-free solder alloys and methods of making sameNOKIA CORP·Filed 2003·Application pending·0 cites
- 1032US4473602APalladium activation of 2.5% silicon iron prior to electroless nickel platingIBM·Filed 1982·Granted Sep 25, 1984·3 cites·7 claims
- 1132US4427448ACorrosion inhibiting compositions for metalsIBM·Filed 1982·Granted Jan 24, 1984·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →