Inventor · disambiguated record
Hisataka Minami
Also filed as: MINAMI HISATAKA
20 granted patents·8 pending applications·46 citations·filing 2008–2022
92Inventor score
Files withHITACHI CHEMICAL CO LTD17MINAMI HISATAKA4IWANO TOMOHIRO3SHOWA DENKO MATERIALS CO LTD3RESONAC CORP1
Top patents by PatentIndex Score
28 records- 0193US10196542B2Abrasive, abrasive set, and method for abrading substrateHITACHI CHEMICAL CO LTD·Filed 2015·Granted Feb 5, 2019·9 cites·56 claims
- 0288US9346978B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted May 24, 2016·9 cites·39 claims
- 0386US9932497B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 3, 2018·7 cites·36 claims
- 0486US9163162B2Polishing agent, polishing agent set and method for polishing baseHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 20, 2015·7 cites·8 claims
- 0577US9346977B2Abrasive, abrasive set, and method for abrading substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted May 24, 2016·3 cites·13 claims
- 0674US2025115795A1Polishing liquid for cmp, polishing liquid set for cmp, and polishing methodRESONAC CORP·Filed 2022·Application pending·0 cites
- 0773US9447306B2CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base materialMINAMI HISATAKA·Filed 2012·Granted Sep 20, 2016·3 cites·17 claims
- 0871US10155886B2Polishing liquid for CMP, and polishing methodHITACHI CHEMICAL CO LTD·Filed 2014·Granted Dec 18, 2018·2 cites·11 claims
- 0966US9799532B2CMP polishing solution and polishing methodMINAMI HISATAKA·Filed 2011·Granted Oct 24, 2017·2 cites·22 claims
- 1063US10796921B2CMP fluid and method for polishing palladiumMINAMI HISATAKA·Filed 2010·Granted Oct 6, 2020·2 cites·18 claims
- 1163US10752807B2Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrateHITACHI CHEMICAL CO LTD·Filed 2014·Granted Aug 25, 2020·1 cites·37 claims
- 1262US9039796B2Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquidIWANO TOMOHIRO·Filed 2011·Granted May 26, 2015·1 cites·19 claims
- 1361US11578236B2Slurry, polishing-liquid set, polishing liquid, and polishing method for baseHITACHI CHEMICAL CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·25 claims
- 1458US10759968B2Abrasive, abrasive set, and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·17 claims
- 1557US10030172B2Abrasive, abrasive set, and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2014·Granted Jul 24, 2018·0 cites·8 claims
- 1653US2010216309A1Cmp polishing liquid and method for polishing substrate using the sameHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 1751US2014017893A1Cmp polishing liquid and method for polishing substrate using the sameHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1850US10549399B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 4, 2020·0 cites·35 claims
- 1949US2013140485A1Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquidIWANO TOMOHIRO·Filed 2013·Application pending·0 cites
- 2049US2013139447A1Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquidIWANO TOMOHIRO·Filed 2013·Application pending·0 cites
- 2147US10557059B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 11, 2020·0 cites·39 claims
- 2247US10557058B2Polishing agent, polishing agent set, and substrate polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 11, 2020·0 cites·12 claims
- 2345US11999875B2Polishing solution and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·0 cites·19 claims
- 2444US2023174822A1Cmp polishing liquid and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2543US8900473B2Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMPMINAMI HISATAKA·Filed 2009·Granted Dec 2, 2014·0 cites·9 claims
- 2643US2023054199A1Cmp polishing liquid and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2741US2015129796A1Abrasive grains, slurry, polishing solution, and manufacturing methods thereforHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2838US11046869B2Polishing liquid, polishing liquid set, and substrate polishing methodHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 29, 2021·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →