Inventor · disambiguated record
Noritaka Niino
Also filed as: NIINO NORITAKA
16 granted patents·5 pending applications·7 citations·filing 2011–2022
85Inventor score
Top patents by PatentIndex Score
21 records- 0175US10014237B2Circuit board having a heat dissipating sheet with varying metal grain sizeKYOCERA CORP·Filed 2015·Granted Jul 3, 2018·4 cites·8 claims
- 0265US10037928B2Circuit board and electronic deviceKYOCERA CORP·Filed 2016·Granted Jul 31, 2018·2 cites·20 claims
- 0360US9756731B2Package for housing electronic component and electronic deviceKYOCERA CORP·Filed 2014·Granted Sep 5, 2017·1 cites·12 claims
- 0459US11965650B2Photoconversion device and illumination systemKYOCERA CORP·Filed 2021·Granted Apr 23, 2024·0 cites·10 claims
- 0558US12320518B2Light emitterKYOCERA CORP·Filed 2022·Granted Jun 3, 2025·0 cites·19 claims
- 0658US12130460B2Optical connectorKYOCERA CORP·Filed 2021·Granted Oct 29, 2024·0 cites·7 claims
- 0753US11734543B2RFID tagKYOCERA CORP·Filed 2020·Granted Aug 22, 2023·0 cites·5 claims
- 0851US2023231086A1Photoconversion device and illumination systemKYOCERA CORP·Filed 2021·Application pending·0 cites
- 0951US2023159367A1Wavelength conversion element and method for manufacturing wavelength conversion elementKYOCERA CORP·Filed 2021·Application pending·0 cites
- 1050US11880729B2RFID tagKYOCERA CORP·Filed 2020·Granted Jan 23, 2024·0 cites·11 claims
- 1146US9847267B2Electronic component housing package and electronic apparatusKYOCERA CORP·Filed 2014·Granted Dec 19, 2017·0 cites·15 claims
- 1245US10645824B2Electronic component housing package and electronic apparatusKYOCERA CORP·Filed 2014·Granted May 5, 2020·0 cites·10 claims
- 1343US10582864B2Measurement sensor package and measurement sensorKYOCERA CORP·Filed 2017·Granted Mar 10, 2020·0 cites·18 claims
- 1442US2016152004A1Composite laminate and electronic deviceKYOCERA CORP·Filed 2014·Application pending·0 cites
- 1541US11928540B2RFID tagKYOCERA CORP·Filed 2020·Granted Mar 12, 2024·0 cites·8 claims
- 1639US11835225B2Photoconversion device and illumination systemKYOCERA CORP·Filed 2021·Granted Dec 5, 2023·0 cites·13 claims
- 1739US11717178B2Measurement sensor package and measurement sensorKYOCERA CORP·Filed 2016·Granted Aug 8, 2023·0 cites·14 claims
- 1839US2022253662A1Rfid tagKYOCERA CORP·Filed 2020·Application pending·0 cites
- 1936US2013078408A1Segmentable wiring board and method for producing the same, and wiring substrate and method for producing the sameNIINO NORITAKA·Filed 2011·Application pending·0 cites
- 2034US11166642B2Measurement sensor package and measurement sensorKYOCERA CORP·Filed 2016·Granted Nov 9, 2021·0 cites·13 claims
- 2123US9947836B2Electronic device mounting substrate and electronic apparatusKYOCERA CORP·Filed 2015·Granted Apr 17, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →