Inventor · disambiguated record
Yi-Nong Lin
Also filed as: Lin yi-nong
15 granted patents·3 pending applications·11 citations·filing 2015–2019
86Inventor score
Files withKINSUS INTERCONNECT TECH CORP18
Top patents by PatentIndex Score
18 records- 0188US9439290B1Carrier board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·7 cites·4 claims
- 0278US9847165B2Winged coil structure and method of manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Dec 19, 2017·2 cites·20 claims
- 0372US10440837B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 8, 2019·1 cites·10 claims
- 0464US10779418B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Sep 15, 2020·0 cites·18 claims
- 0563US10039185B2Manufacturing method of landless multilayer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Jul 31, 2018·1 cites·10 claims
- 0662US10366822B2Method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jul 30, 2019·0 cites·15 claims
- 0760US10256030B2Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Apr 9, 2019·0 cites·9 claims
- 0859US11495390B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Nov 8, 2022·0 cites·10 claims
- 0957US10779405B2Landless multilayer circuit board and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 15, 2020·0 cites·11 claims
- 1056US10440836B2Double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Oct 8, 2019·0 cites·3 claims
- 1156US10405423B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 1254US9967975B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted May 8, 2018·0 cites·13 claims
- 1352US10256028B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Apr 9, 2019·0 cites·10 claims
- 1445US9570227B1Magnetic excitation coil structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Feb 14, 2017·0 cites·4 claims
- 1538US2018160533A1Multilayer printed circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Application pending·0 cites
- 1637US10371719B2Printed circuit board circuit test fixture with adjustable density of test probes mounted thereonKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Aug 6, 2019·0 cites·10 claims
- 1737US2017140857A1Modified magnetic coil structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Application pending·0 cites
- 1835US2016262269A1Copper etching method for manufacturing circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →