Inventor · disambiguated record
Chiao-Cheng Chang
Also filed as: CHANG CHIAO-CHENG
21 granted patents·9 pending applications·26 citations·filing 2008–2024
91Inventor score
Top patents by PatentIndex Score
30 records- 0188US9439290B1Carrier board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·7 cites·4 claims
- 0283US9901016B1Electromagnetic-interference shielding deviceKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Feb 20, 2018·3 cites·7 claims
- 0378US9847165B2Winged coil structure and method of manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Dec 19, 2017·2 cites·20 claims
- 0472US10440837B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 8, 2019·1 cites·10 claims
- 0571US10383265B2Electromagnetic-interference shielding deviceKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Aug 13, 2019·1 cites·9 claims
- 0669US8034155B2Nanosilver porous material particles and fabricating method thereofAPEX NANOTEK CORP·Filed 2008·Granted Oct 11, 2011·9 cites·14 claims
- 0764US10779418B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Sep 15, 2020·0 cites·18 claims
- 0863US10039185B2Manufacturing method of landless multilayer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Jul 31, 2018·1 cites·10 claims
- 0962US10366822B2Method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jul 30, 2019·0 cites·15 claims
- 1062US10170403B2Ameliorated compound carrier board structure of flip-chip chip-scale packageKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jan 1, 2019·2 cites·8 claims
- 1162US2025393119A1Anti-warpage carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 1262US2025393123A1Impact-resistant reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 1362US2025389754A1Test fixtureKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 1460US10256030B2Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Apr 9, 2019·0 cites·9 claims
- 1560US2025247954A1Micro circuit structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 1660US2025079333A1Anti-warpage reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2023·Application pending·0 cites
- 1759US11495390B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Nov 8, 2022·0 cites·10 claims
- 1858US10104817B1Electromagnetic-interference shielding device and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 16, 2018·0 cites·11 claims
- 1957US10779405B2Landless multilayer circuit board and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 15, 2020·0 cites·11 claims
- 2056US10440836B2Double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Oct 8, 2019·0 cites·3 claims
- 2156US10405423B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 2254US9967975B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted May 8, 2018·0 cites·13 claims
- 2352US10256028B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Apr 9, 2019·0 cites·10 claims
- 2445US9570227B1Magnetic excitation coil structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Feb 14, 2017·0 cites·4 claims
- 2542US10720694B2Antenna carrier plate structureKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Jul 21, 2020·0 cites·10 claims
- 2638US2018160533A1Multilayer printed circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Application pending·0 cites
- 2737US10371719B2Printed circuit board circuit test fixture with adjustable density of test probes mounted thereonKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Aug 6, 2019·0 cites·10 claims
- 2837US2017140857A1Modified magnetic coil structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Application pending·0 cites
- 2937US2011311638A1Nanosilver porous material particles and fabricating method thereofCHANG CHIAO-CHENG·Filed 2011·Application pending·0 cites
- 3035US2016262269A1Copper etching method for manufacturing circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →