Inventor · disambiguated record
Rieka Ouchi
Also filed as: OUCHI RIEKA
4 granted patents·21 citations·filing 2004–2015
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0174US7238548B2Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jul 3, 2007·17 cites·19 claims
- 0265US7763985B2Flip-chip type semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Jul 27, 2010·2 cites·8 claims
- 0364US7554205B2Flip-chip type semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Jun 30, 2009·2 cites·9 claims
- 0439US9820400B2Package and method for fabricating packageNEC TOSHIBA SPACE SYS LTD·Filed 2015·Granted Nov 14, 2017·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Rieka Ouchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →