Inventor · disambiguated record
Pierre-Yves Guittet
Also filed as: GUITTET PIERRE-YVES · GUITTET PIERRE-YVES JEROME YVAN
10 granted patents·1 pending application·13 citations·filing 2004–2021
81Inventor score
Top patents by PatentIndex Score
11 records- 0174US11086229B2Method to predict yield of a device manufacturing processASML NETHERLANDS BV·Filed 2018·Granted Aug 10, 2021·1 cites·24 claims
- 0273US7405089B2Method and apparatus for measuring a surface profile of a sampleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 29, 2008·5 cites·21 claims
- 0370US11714357B2Method to predict yield of a device manufacturing processASML NETHERLANDS BV·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 0464US7372579B2Apparatus and method for monitoring trench profiles and for spectrometrologic analysisINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 13, 2008·6 cites·25 claims
- 0559US8460946B2Methods of processing and inspecting semiconductor substratesMARKWORT LARS·Filed 2011·Granted Jun 11, 2013·1 cites·20 claims
- 0658US11385554B2Metrology apparatus and method for determining a characteristic relating to one or more structures on a substrateASML NETHERLANDS BV·Filed 2019·Granted Jul 12, 2022·0 cites·20 claims
- 0750US10895811B2Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing methodASML NETHERLANDS BV·Filed 2019·Granted Jan 19, 2021·0 cites·15 claims
- 0846US2005118735A1Method for determining or inspecting a property of a patterned layerFiled 2004·Application pending·0 cites
- 0945US7262837B2Noninvasive method for characterizing and identifying embedded micropatternsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 28, 2007·0 cites·7 claims
- 1038US8501503B2Methods of inspecting and manufacturing semiconductor wafersMARKWORT LARS·Filed 2012·Granted Aug 6, 2013·0 cites·32 claims
- 1132US8778702B2Method of inspecting and processing semiconductor wafersMARKWORT LARS·Filed 2010·Granted Jul 15, 2014·0 cites·41 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →