Inventor · disambiguated record
Syota Miki
Also filed as: MIKI SYOTA
7 granted patents·1 pending application·37 citations·filing 2008–2014
80Inventor score
Top patents by PatentIndex Score
8 records- 0190US8143531B2Electronic component mounting packageMIKI SYOTA·Filed 2008·Granted Mar 27, 2012·27 cites·3 claims
- 0269US9392703B2Pad structure and mounted structureSHINKO ELECTRIC IND CO·Filed 2014·Granted Jul 12, 2016·3 cites·4 claims
- 0368US8330279B2Semiconductor deviceMIKI SYOTA·Filed 2011·Granted Dec 11, 2012·3 cites·6 claims
- 0462US8987902B2Semiconductor device, semiconductor package, and method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2012·Granted Mar 24, 2015·2 cites·8 claims
- 0561US8299586B2Semiconductor device and method of manufacturing the sameYAMANO TAKAHARU·Filed 2010·Granted Oct 30, 2012·1 cites·14 claims
- 0658US8008123B2Manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2010·Granted Aug 30, 2011·1 cites·4 claims
- 0738US2012153507A1Semiconductor device and method for manufacturing the sameMIKI SYOTA·Filed 2011·Application pending·0 cites
- 0837US8779573B2Semiconductor package having a silicon reinforcing member embedded in resinMIKI SYOTA·Filed 2011·Granted Jul 15, 2014·0 cites·3 claims
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