Inventor · disambiguated record
Yoshio Oshima
Also filed as: OSHIMA YOSHIO
10 granted patents·442 citations·filing 1983–1992
92Inventor score
Files withHITACHI LTD10
Top patents by PatentIndex Score
10 records- 0187US5176310AMethod and apparatus for wire bondHITACHI LTD·Filed 1992·Granted Jan 5, 1993·100 cites·12 claims
- 0286US5210844ASystem using selected logical processor identification based upon a select address for accessing corresponding partition blocks of the main memoryHITACHI LTD·Filed 1989·Granted May 11, 1993·117 cites·11 claims
- 0384US5110032AMethod and apparatus for wire bondingHITACHI LTD·Filed 1991·Granted May 5, 1992·72 cites·4 claims
- 0482US5037023AMethod and apparatus for wire bondingHITACHI LTD·Filed 1989·Granted Aug 6, 1991·53 cites·32 claims
- 0563US5060841Awire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatusHITACHI LTD·Filed 1990·Granted Oct 29, 1991·35 cites·12 claims
- 0647US5226132AMultiple virtual addressing using/comparing translation pairs of addresses comprising a space address and an origin address (sto) while using space registers as storage devices for a data processing systemHITACHI LTD·Filed 1989·Granted Jul 6, 1993·18 cites·5 claims
- 0746US4677583AApparatus for decimal multiplicationHITACHI LTD·Filed 1984·Granted Jun 30, 1987·16 cites·11 claims
- 0844US4603397ABinary coded decimal number division apparatusHITACHI LTD·Filed 1983·Granted Jul 29, 1986·14 cites·4 claims
- 0938US4635220ABinary coded decimal number division apparatusHITACHI LTD·Filed 1983·Granted Jan 6, 1987·11 cites·5 claims
- 1032US4543641AMultiplication device using multiple-input adderHITACHI LTD·Filed 1983·Granted Sep 24, 1985·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →