Inventor · disambiguated record
Hideaki Nagaoka
Also filed as: NAGAOKA HIDEAKI
14 granted patents·3 pending applications·250 citations·filing 1997–2019
93Inventor score
Top patents by PatentIndex Score
17 records- 0187US9142476B2Semiconductor package, cooling mechanism and method for manufacturing semiconductor packageFUJITSU LTD·Filed 2013·Granted Sep 22, 2015·7 cites·18 claims
- 0285US6333877B1Static type semiconductor memory device that can suppress standby currentMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 25, 2001·46 cites·14 claims
- 0384US5973533ASemiconductor gate circuit having reduced dependency of input/output characteristics on power supply voltageMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 26, 1999·49 cites·18 claims
- 0478US5973984AStatic semiconductor memory device with reduced power consumption, chip occupied area and access timeMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 26, 1999·43 cites·19 claims
- 0572US6396123B1Semiconductor device provided with on-chip decoupling condenser utilizing CMP dummy patternsMITSUBISHI ELECTRIC CORP·Filed 2000·Granted May 28, 2002·19 cites·6 claims
- 0665US9455212B2Loop heat pipe system and information processing apparatusUCHIDA HIROKI·Filed 2012·Granted Sep 27, 2016·2 cites·13 claims
- 0763US10311189B2Simulation method and simulation apparatusFUJITSU LTD·Filed 2014·Granted Jun 4, 2019·1 cites·16 claims
- 0863US6169313B1Static semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 2, 2001·35 cites·16 claims
- 0960US6316812B1Static semiconductor memory device with expanded operating voltage rangeMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 13, 2001·12 cites·13 claims
- 1060US6307772B1Static type semiconductor memory device for lower current consumptionMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 23, 2001·12 cites·7 claims
- 1152US6400597B1Semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 4, 2002·7 cites·8 claims
- 1248US5886934ASemiconductor memory device capable of through rate control of external output signal waveformMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 23, 1999·11 cites·16 claims
- 1344US6288962B1Semiconductor device allowing fast signal transfer and system employing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 11, 2001·4 cites·20 claims
- 1444US2019306982A1Circuit board and method of manufacturing circuit boardFUJITSU LTD·Filed 2019·Application pending·0 cites
- 1541US2012312506A1Loop heat pipeUCHIDA HIROKI·Filed 2012·Application pending·0 cites
- 1641US2019215963A1Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 1738US6781917B2Semiconductor memory device with dual port memory cellsRENESAS TECH CORP·Filed 2002·Granted Aug 24, 2004·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →