Inventor · disambiguated record
Takehito Koshizawa
Also filed as: KOSHIZAWA TAKEHITO
26 granted patents·3 pending applications·174 citations·filing 2012–2024
93Inventor score
Top patents by PatentIndex Score
29 records- 0198US9385028B2Air gap processAPPLIED MATERIALS INC·Filed 2014·Granted Jul 5, 2016·146 cites·15 claims
- 0294US10998329B2Methods and apparatus for three dimensional NAND structure fabricationAPPLIED MATERIALS INC·Filed 2019·Granted May 4, 2021·11 cites·9 claims
- 0386US11043372B2High-density low temperature carbon films for hardmask and other patterning applicationsAPPLIED MATERIALS INC·Filed 2018·Granted Jun 22, 2021·4 cites·19 claims
- 0486US10954129B2Diamond-like carbon as mandrelAPPLIED MATERIALS INC·Filed 2018·Granted Mar 23, 2021·3 cites·10 claims
- 0584US9508561B2Methods for forming interconnection structures in an integrated cluster system for semicondcutor applicationsAPPLIED MATERIALS INC·Filed 2014·Granted Nov 29, 2016·6 cites·20 claims
- 0682US11469097B2Carbon hard masks for patterning applications and methods related theretoAPPLIED MATERIALS INC·Filed 2019·Granted Oct 11, 2022·2 cites·20 claims
- 0781US11145509B2Method for forming and patterning a layer and/or substrateAPPLIED MATERIALS INC·Filed 2020·Granted Oct 12, 2021·1 cites·17 claims
- 0880US12482646B2Processes for depositing SiB filmsAPPLIED MATERIALS INC·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 0977US12198936B2Defect free germanium oxide gap fillAPPLIED MATERIALS INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1076US12486577B2Pulsed plasma (DC/RF) deposition of high quality C films for patterningAPPLIED MATERIALS INC·Filed 2023·Granted Dec 2, 2025·0 cites·11 claims
- 1175US10910381B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2019·Granted Feb 2, 2021·1 cites·19 claims
- 1274US11784042B2Carbon hard masks for patterning applications and methods related theretoAPPLIED MATERIALS INC·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 1374US11638374B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2022·Granted Apr 25, 2023·0 cites·10 claims
- 1470US11335690B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2021·Granted May 17, 2022·0 cites·10 claims
- 1569US11545504B2Methods and apparatus for three dimensional NAND structure fabricationAPPLIED MATERIALS INC·Filed 2021·Granted Jan 3, 2023·0 cites·13 claims
- 1669US11430801B2Methods and apparatus for three dimensional NAND structure fabricationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 30, 2022·0 cites·13 claims
- 1768US12183578B2Method for forming and patterning a layer and/or substrateAPPLIED MATERIALS INC·Filed 2021·Granted Dec 31, 2024·0 cites·19 claims
- 1867US12033848B2Processes for depositing sib filmsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 1967US11781218B2Defect free germanium oxide gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Oct 10, 2023·0 cites·20 claims
- 2060US12148475B2Selection gate separation for 3D NANDAPPLIED MATERIALS INC·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 2159US11603591B2Pulsed plasma (DC/RF) deposition of high quality C films for patterningAPPLIED MATERIALS INC·Filed 2018·Granted Mar 14, 2023·0 cites·15 claims
- 2256US12334358B2Integration processes utilizing boron-doped silicon materialsAPPLIED MATERIALS INC·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 2355US11791155B2Diffusion barriers for germaniumAPPLIED MATERIALS INC·Filed 2020·Granted Oct 17, 2023·0 cites·19 claims
- 2454US12018364B2Super-conformal germanium oxide filmsAPPLIED MATERIALS INC·Filed 2020·Granted Jun 25, 2024·0 cites·15 claims
- 2550US11638377B2Self-aligned select gate cut for 3D NANDAPPLIED MATERIALS INC·Filed 2020·Granted Apr 25, 2023·0 cites·18 claims
- 2650US10403502B2Boron doped tungsten carbide for hardmask applicationsAPPLIED MATERIALS INC·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
- 2747US2021327891A1Stack for 3d-nand memory cellAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2843US2015079799A1Method for stabilizing an interface post etch to minimize queue time issues before next processing stepAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2936US2014041803A1Method and apparatus for liquid treatment of wafer shaped articlesKOSHIZAWA TAKEHITO·Filed 2012·Application pending·0 cites
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