Inventor · disambiguated record
Han Ul Lee
Also filed as: LEE HAN · LEE HAN UL
12 granted patents·5 pending applications·125 citations·filing 2004–2021
91Inventor score
Files withSAMSUNG ELECTRO MECH6LG DISPLAY CO LTD3SAMSUNG ELECTRONICS CO LTD3LEE HAN UL2GM GLOBAL TECH OPERATIONS LLC1
Top patents by PatentIndex Score
17 records- 0198US10490771B2Flexible display and electronic device including the sameLG DISPLAY CO LTD·Filed 2018·Granted Nov 26, 2019·25 cites·20 claims
- 0297US10558242B2Foldable display deviceLG DISPLAY CO LTD·Filed 2018·Granted Feb 11, 2020·19 cites·18 claims
- 0397US10026668B1Passivation layer having an opening for under bump metallurgySAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·26 cites·18 claims
- 0493US11108011B2Flexible display and electronic device including the sameLG DISPLAY CO LTD·Filed 2019·Granted Aug 31, 2021·4 cites·20 claims
- 0593US10403579B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·8 cites·16 claims
- 0692US11669998B2Method and system for learning a neural network to determine a pose of a vehicle in an environmentGM GLOBAL TECH OPERATIONS LLC·Filed 2021·Granted Jun 6, 2023·3 cites·18 claims
- 0788US10312014B2Inductor with improved inductance for miniaturization and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 4, 2019·5 cites·8 claims
- 0878US7050883B2Off-line feed rate scheduling for reduction of machining time and enhancement of machining accuracy in CNC machiningPOSTECH FOUNDATION·Filed 2004·Granted May 23, 2006·28 cites·13 claims
- 0976US11158579B2Semiconductor package including a backside redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·2 cites·17 claims
- 1072US10879189B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·1 cites·18 claims
- 1172US10347556B2Passivation layer having opening for under bump metallurgySAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 9, 2019·1 cites·12 claims
- 1270US9018539B2Printed circuit board and method for manufacturing the sameLEE HAN UL·Filed 2012·Granted Apr 28, 2015·3 cites·8 claims
- 1351US2010147575A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1446US2014102766A1Multi-layer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1541US2014116753A1Wiring board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1640US2013321115A1Multilayered-type inductor and method of manufacturing the sameLEE HAN·Filed 2012·Application pending·0 cites
- 1737US2012168220A1Multi-layer printed circuit board and method of manufacturing the sameLEE HAN UL·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →