Inventor · disambiguated record
Chikage Noritake
Also filed as: NORITAKE CHIKAGE
12 granted patents·2 pending applications·358 citations·filing 1995–2014
91Inventor score
Top patents by PatentIndex Score
14 records- 0196US5656858ASemiconductor device with bump structureNIPPON DENSO CO·Filed 1995·Granted Aug 12, 1997·279 cites·18 claims
- 0284US9070666B2Semiconductor device including coolerDENSO CORP·Filed 2014·Granted Jun 30, 2015·5 cites·1 claims
- 0382US7148125B2Method for manufacturing semiconductor power deviceDENSO CORP·Filed 2002·Granted Dec 12, 2006·28 cites·11 claims
- 0478US8530281B2Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chipNORITAKE CHIKAGE·Filed 2011·Granted Sep 10, 2013·7 cites·10 claims
- 0577US7944045B2Semiconductor module molded by resin with heat radiation plate opened outside from moldDENSO CORP·Filed 2009·Granted May 17, 2011·7 cites·9 claims
- 0674US6927167B2Method for manufacturing semiconductor device having controlled surface roughnessDENSO CORP·Filed 2003·Granted Aug 9, 2005·21 cites·14 claims
- 0772US8957517B2Semiconductor device including coolerDENSO CORP·Filed 2013·Granted Feb 17, 2015·2 cites·2 claims
- 0870US8558375B2Semiconductor package cooled by grounded coolerMAMITSU KUNIAKI·Filed 2011·Granted Oct 15, 2013·2 cites·4 claims
- 0970US7601625B2Method for manufacturing semiconductor device having solder layerDENSO CORP·Filed 2005·Granted Oct 13, 2009·5 cites·12 claims
- 1062US7361996B2Semiconductor device having tin-based solder layer and method for manufacturing the sameDENSO CORP·Filed 2005·Granted Apr 22, 2008·2 cites·12 claims
- 1156US8884426B2Semiconductor device including coolerDENSO CORP·Filed 2014·Granted Nov 11, 2014·0 cites·2 claims
- 1248US7579212B2Semiconductor device having tin-based solder layer and method for manufacturing the sameDENSO CORP·Filed 2007·Granted Aug 25, 2009·0 cites·16 claims
- 1341US2011316143A1Semiconductor module with cooling mechanism and production method thereofNORITAKE CHIKAGE·Filed 2011·Application pending·0 cites
- 1434US2011316142A1Semiconductor module with resin-molded package of heat spreader and power semiconductor chipNORITAKE CHIKAGE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →