Inventor · disambiguated record
Kazuhiko Bandoh
Also filed as: BANDOH KAZUHIKO
4 granted patents·2 pending applications·32 citations·filing 1994–2009
74Inventor score
Top patents by PatentIndex Score
6 records- 0163US7287975B2Resin mold material and resin moldJAPAN FINE CERAMICS CT·Filed 2004·Granted Oct 30, 2007·5 cites·15 claims
- 0246US2011233821A1Compression resin sealing and molding method for electronic component and apparatus thereforTOWA CORP·Filed 2009·Application pending·0 cites
- 0341US5750059AMethod of molding resin to seal electronic partsTOWA CORP·Filed 1994·Granted May 12, 1998·15 cites·18 claims
- 0438US6007316AApparatus for molding resin to seal electronic partsTOWA CORP·Filed 1997·Granted Dec 28, 1999·10 cites·6 claims
- 0538US2007069422A1Method of resin-seal-molding electronic component and apparatus thereforTOWA CORP·Filed 2006·Application pending·0 cites
- 0626US6594889B1Method for processing leadframeTOWA CORP·Filed 1999·Granted Jul 22, 2003·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →