Inventor · disambiguated record
Scott A. Estes
Also filed as: ESTES SCOTT A · ESTES SCOTT ALAN
14 granted patents·1 pending application·208 citations·filing 1992–2010
92Inventor score
Top patents by PatentIndex Score
15 records- 0189US6812193B2Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 2002·Granted Nov 2, 2004·53 cites·29 claims
- 0276US5962384AMethod for cleaning semiconductor devicesIBM·Filed 1997·Granted Oct 5, 1999·40 cites·9 claims
- 0373US5459001ALow stress electrodeposition of gold for x-ray mask fabricationIBM·Filed 1994·Granted Oct 17, 1995·18 cites·9 claims
- 0471US6699400B1Etch process and apparatus thereforFiled 1999·Granted Mar 2, 2004·31 cites·14 claims
- 0567US6162565ADilute acid rinse after develop for chrome etchIBM·Filed 1998·Granted Dec 19, 2000·22 cites·26 claims
- 0665US7332054B2Etch apparatusIBM·Filed 2004·Granted Feb 19, 2008·8 cites·12 claims
- 0762US7888142B2Copper contamination detection method and system for monitoring copper contaminationIBM·Filed 2007·Granted Feb 15, 2011·1 cites·15 claims
- 0859US5318687ALow stress electrodeposition of gold for X-ray mask fabricationIBM·Filed 1992·Granted Jun 7, 1994·13 cites·6 claims
- 0956US6191085B1Method for cleaning semiconductor devicesIBM·Filed 1999·Granted Feb 20, 2001·17 cites·10 claims
- 1054US6758912B2Method of inhibiting contaminants using dilute acid rinseIBM·Filed 2002·Granted Jul 6, 2004·3 cites·13 claims
- 1152US2008066864A1Etch apparatusBALLANTINE ARNE W·Filed 2007·Application pending·0 cites
- 1250US6494966B2Method of minimizing contaminating deposits using dilute acid rinseIBM·Filed 2000·Granted Dec 17, 2002·2 cites·11 claims
- 1345US7957917B2Copper contamination detection method and system for monitoring copper contaminationIBM·Filed 2007·Granted Jun 7, 2011·0 cites·18 claims
- 1440US8236580B2Copper contamination detection method and system for monitoring copper contaminationBURNHAM JAY SANFORD·Filed 2010·Granted Aug 7, 2012·0 cites·16 claims
- 1535US7855130B2Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operationsIBM·Filed 2003·Granted Dec 21, 2010·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →