Inventor · disambiguated record
Kyu Jin Lee
Also filed as: LEE KYU · LEE KYU J · LEE KYU JIN
22 granted patents·9 pending applications·773 citations·filing 1994–2024
96Inventor score
Top patents by PatentIndex Score
31 records- 0195US5900676ASemiconductor device package structure having column leads and a method for production thereofSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted May 4, 1999·264 cites·13 claims
- 0291US6013946AWire bond packages for semiconductor chips and related methods and assembliesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jan 11, 2000·142 cites·25 claims
- 0390US6252298B1Semiconductor chip package using flexible circuit board with central openingSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jun 26, 2001·137 cites·19 claims
- 0489US7245008B2Ball grid array package, stacked semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 17, 2007·55 cites·20 claims
- 0587US10967750B2System and method for charging plug-in hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Apr 6, 2021·5 cites·4 claims
- 0686US7848218B2Virtual multi-antenna method for OFDM system and OFDM-based cellular systemKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Dec 7, 2010·14 cites·44 claims
- 0781US8795817B2Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured therebyKWAK CHANG HOON·Filed 2011·Granted Aug 5, 2014·7 cites·15 claims
- 0879US9722146B2Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 1, 2017·4 cites·13 claims
- 0975US6736306B2Semiconductor chip package comprising enhanced padsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 18, 2004·27 cites·26 claims
- 1072US5894107AChip-size package (CSP) using a multi-layer laminated lead frameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 13, 1999·47 cites·9 claims
- 1166US10337390B2System and method for charging plug-in hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2016·Granted Jul 2, 2019·1 cites·7 claims
- 1265US9537068B2Light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 3, 2017·2 cites·17 claims
- 1364USD624924SDongle for receiving digital TV broadcastingDTV INTERACTIVE CO LTD·Filed 2009·Granted Oct 5, 2010·14 cites·1 claims
- 1462US2025160689A1Respiratory sensing device and method of using the respiratory sensing deviceATSENS CO LTD·Filed 2024·Application pending·0 cites
- 1560US2024181053A1Method for producing immune cell compositionNEOGENTC CORP·Filed 2022·Application pending·0 cites
- 1659US5581195ASemiconductor chip holding deviceSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Dec 3, 1996·20 cites·9 claims
- 1759US2025025075A1Continuous analyte meter having switch activator interworking with actuatorUXN CO LTD·Filed 2023·Application pending·0 cites
- 1859US2025352099A1Continuous analyte meter starting power supply upon separation of inserterUXN CO LTD·Filed 2023·Application pending·0 cites
- 1959US2025325205A1Continuous analyte meter having transmitterUXN CO LTD·Filed 2023·Application pending·0 cites
- 2055US7692291B2Circuit board having a heating means and a hermetically sealed multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 6, 2010·7 cites·19 claims
- 2153US7023096B2Multi-chip package having spacer that is inserted between chips and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 4, 2006·7 cites·12 claims
- 2248US11584251B2Method for displaying charge energy by solar roof system of vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Feb 21, 2023·0 cites·12 claims
- 2347US12007695B2Rapid large-scale fabrication of metasurfaces with complex unit cellsUNIV TEXAS·Filed 2021·Granted Jun 11, 2024·0 cites·10 claims
- 2447US2010081236A1Method of manufacturing semiconductor device with embedded interposerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2542US5706172AStacked semiconductor package having supporting bars and a socket thereforSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Jan 6, 1998·10 cites·12 claims
- 2639US10877193B2Polarization independent wideband reflectors and methods for their manufactureMAGNUSSON ROBERT·Filed 2016·Granted Dec 29, 2020·0 cites·17 claims
- 2739US9381959B2Rubber crawler having metal core for improvement of wheel separation and durabilityPARK JUNG HO·Filed 2010·Granted Jul 5, 2016·0 cites·2 claims
- 2839US2018021628A1Core stability exercise management systemCRETA CO LTD·Filed 2016·Application pending·0 cites
- 2936US5940680AMethod for manufacturing known good die array having solder bumpsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 17, 1999·10 cites·2 claims
- 3029US2012181571A1Adhesive film for light emitting device and method of manufacturing led package using the samePARK NA NA·Filed 2012·Application pending·0 cites
- 3129US2012019547A1Apparatus and method for providing augmented reality using additional dataTJEN SUNG-WOON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →