Inventor · disambiguated record
James L. Speidell
Also filed as: SPEIDELL JAMES · SPEIDELL JAMES L · SPEIDELL JAMES LOUIS
54 granted patents·2 pending applications·2,240 citations·filing 1983–2020
99Inventor score
Top patents by PatentIndex Score
56 records- 0196US6657723B2Multimode planar spectrographs for wavelength demultiplexing and methods of fabricationIBM·Filed 2000·Granted Dec 2, 2003·128 cites·34 claims
- 0296US6332569B1Etched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 2000·Granted Dec 25, 2001·97 cites·12 claims
- 0396US4551192AElectrostatic or vacuum pinchuck formed with microcircuit lithographyIBM·Filed 1983·Granted Nov 5, 1985·434 cites·30 claims
- 0495US6429755B2Method for constructing an encapsulated MEMS band-pass filter for integrated circuitsIBM·Filed 2001·Granted Aug 6, 2002·78 cites·15 claims
- 0595US4523971AProgrammable ion beam patterning systemIBM·Filed 1984·Granted Jun 18, 1985·75 cites·18 claims
- 0693US6275122B1Encapsulated MEMS band-pass filter for integrated circuitsIBM·Filed 1999·Granted Aug 14, 2001·72 cites·15 claims
- 0793US5706067AReflective spatial light modulator arrayIBM·Filed 1997·Granted Jan 6, 1998·138 cites·19 claims
- 0892US6614109B2Method and apparatus for thermal management of integrated circuitsIBM·Filed 2000·Granted Sep 2, 2003·72 cites·14 claims
- 0992US5775569AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1996·Granted Jul 7, 1998·120 cites·16 claims
- 1091US7497366B2Global vacuum injection molded solder system and methodIBM·Filed 2007·Granted Mar 3, 2009·17 cites·1 claims
- 1191US6105852AEtched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 1998·Granted Aug 22, 2000·73 cites·7 claims
- 1290US6399406B2Encapsulated MEMS band-pass filter for integrated circuits and method of fabrication thereofIBM·Filed 2001·Granted Jun 4, 2002·44 cites·12 claims
- 1390US6384312B1Thermoelectric coolers with enhanced structured interfacesIBM·Filed 2000·Granted May 7, 2002·65 cites·20 claims
- 1489US5225926ADurable optical elements fabricated from free standing polycrystalline diamond and non-hydrogenated amorphous diamond like carbon (dlc) thin filmsIBM·Filed 1991·Granted Jul 6, 1993·98 cites·16 claims
- 1588US7416104B2Rotational fill techniques for injection molding of solderIBM·Filed 2006·Granted Aug 26, 2008·14 cites·1 claims
- 1687US4923772AHigh energy laser mask and method of making sameKIRCH STEVEN J·Filed 1989·Granted May 8, 1990·56 cites·8 claims
- 1786US6893902B2Method and apparatus for thermal management of integrated circuitsIBM·Filed 2002·Granted May 17, 2005·38 cites·12 claims
- 1885US6149122AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Nov 21, 2000·61 cites·5 claims
- 1985US6020946ADry processing for liquid-crystal displays using low energy ion bombardmentIBM·Filed 1998·Granted Feb 1, 2000·83 cites·32 claims
- 2084US8269291B2Low temperature Bi-CMOS compatible process for MEMS RF resonators and filtersBUCHWALTER LEENA PAIVIKKI·Filed 2011·Granted Sep 18, 2012·6 cites·31 claims
- 2183US8551816B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2012·Granted Oct 8, 2013·6 cites·6 claims
- 2283US7410092B2Fill head for injection molding of solderIBM·Filed 2006·Granted Aug 12, 2008·10 cites·1 claims
- 2383US6390439B1Hybrid molds for molten solder screening processIBM·Filed 1999·Granted May 21, 2002·44 cites·40 claims
- 2483US6061114AAlignment of liquid crystal layersIBM·Filed 1998·Granted May 9, 2000·71 cites·20 claims
- 2582US7943412B2Low temperature Bi-CMOS compatible process for MEMS RF resonators and filtersIBM·Filed 2002·Granted May 17, 2011·24 cites·9 claims
- 2682US6262464B1Encapsulated MEMS brand-pass filter for integrated circuitsIBM·Filed 2000·Granted Jul 17, 2001·23 cites·27 claims
- 2780US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 2880US7410090B2Conductive bonding material fill techniquesIBM·Filed 2006·Granted Aug 12, 2008·7 cites·20 claims
- 2980US6798953B1Guides lithographically fabricated on semiconductor devicesIBM·Filed 2000·Granted Sep 28, 2004·23 cites·21 claims
- 3078US6832747B2Hybrid molds for molten solder screening processIBM·Filed 2002·Granted Dec 21, 2004·18 cites·17 claims
- 3178US6133633AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Oct 17, 2000·40 cites·4 claims
- 3276US6426241B1Method for forming three-dimensional circuitization and circuits formedIBM·Filed 1999·Granted Jul 30, 2002·39 cites·44 claims
- 3374US6424388B1Reflective spatial light modulator arrayIBM·Filed 1998·Granted Jul 23, 2002·47 cites·26 claims
- 3473US8237271B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2007·Granted Aug 7, 2012·5 cites·10 claims
- 3572US7784673B2Rotational fill techniques for injection molding of solderIBM·Filed 2008·Granted Aug 31, 2010·4 cites·20 claims
- 3667US7669748B2Conductive bonding material fill techniquesIBM·Filed 2008·Granted Mar 2, 2010·1 cites·6 claims
- 3766US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 3866US6180291B1Static resistant reticleIBM·Filed 1999·Granted Jan 30, 2001·28 cites·64 claims
- 3964US7784664B2Fill head for injection molding of solderIBM·Filed 2008·Granted Aug 31, 2010·2 cites·1 claims
- 4062US6350625B1Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereofIBM·Filed 2000·Granted Feb 26, 2002·6 cites·35 claims
- 4161US6654089B2Maskless method and system for creating a dual-domain pattern on a diamond-like carbon alignment layerIBM·Filed 2001·Granted Nov 25, 2003·7 cites·16 claims
- 4259US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 4359US4714831ASpherical retarding grid analyzerIBM·Filed 1986·Granted Dec 22, 1987·10 cites·13 claims
- 4454US10750615B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 4550US5742065AHeater for membrane mask in an electron-beam lithography systemIBM·Filed 1997·Granted Apr 21, 1998·15 cites·12 claims
- 4649US5756236AFabrication of high resolution aluminum ablation masksIBM·Filed 1997·Granted May 26, 1998·11 cites·28 claims
- 4747US11651973B2Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputerIBM·Filed 2020·Granted May 16, 2023·0 cites·15 claims
- 4847US5289632AApplying conductive lines to integrated circuitsIBM·Filed 1992·Granted Mar 1, 1994·12 cites·27 claims
- 4946US7694869B2Universal mold for injection molding of solderIBM·Filed 2006·Granted Apr 13, 2010·0 cites·5 claims
- 5045US2012270351A1Low temperature bi-cmos compatible process for mems rf resonators and filtersBUCHWALTER LEENA PAIVIKKI·Filed 2012·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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